Data Sheet AD8133
Rev. A | Page 5 of 17
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 12 V
OCM
S
Power Dissipation See Figure 3
Input Common-Mode Voltage ±V
S
Storage Temperature −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature Range
(Soldering 10 sec)
300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, i.e., θ
JA
is specified
for the device soldered in a circuit board in still air.
Table 4. Thermal Resistance with the Underside Pad
Connected to the Plane
JA
24-Lead LFCSP/4-Layer 70 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the AD8133 package is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit may change the stresses that
the package exerts on the die, permanently shifting the
parametric performance of the AD8133. Exceeding a junction
temperature of 175°C for an extended period of time can result
in changes in the silicon devices potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). The load current consists of differential
and common-mode currents flowing to the loads, as well as
currents flowing through the internal differential and common-
mode feedback loops. The internal resistor tap used in the
common-mode feedback loop places a 4 kΩ differential load on
the output. RMS output voltages should be considered when
dealing with ac signals.
Airflow reduces θ
JA
. Also, more metal directly in contact with
the package leads from metal traces, through holes, ground,
and power planes reduces the θ
JA
. The exposed paddle on the
underside of the package must be soldered to a pad on the PCB
surface that is thermally connected to a copper plane in order to
achieve the specified θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package versus ambient temperature for the 24-lead LFCSP
(70°C/W) package on a JEDEC standard 4-layer board with the
underside paddle soldered to a pad that is thermally connected
to a PCB plane. θ
JA
values are approximations.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–40
–20 0 20 40 60 80
04769-0-024
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
LFCSP
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
