Atmel ATPL100A [Summary datasheet]
43002A-ATPL-03/12
4
2. Package and Pinout
2.1 144-Lead LQFP Package Outline
Figure 2-1. Orientation of the 144-Lead Package
1
36
37
72
73
108
109
144
Atmel ATPL100A [Summary datasheet]
43002A-ATPL-03/12
5
2.2 144-Lead LQFP Pinout
Table 2-1. ATPL100A 144-Lead LQFP pinout
1 P3.3/INT1 37 TRIAC_0 73 P4.0/RXD2 109 BCKP_3
2 VCC 38 P5.5/TXD1/INTA1 74 VCC 110 BCKP_2
3 GND 39 P5.4/RXD1/INTA0 75 GND 111 BCKP_1
4 GND 40 P4.7/T2EX/INTA3 76 SEGM_23/INTC3 112 BCKP_0
5 GND 41 P4.6/T2/INTA2 77 SEGM_22/INTC2 113 GND
6 TDI 42 P1.7/SSN 78 SEGM_21/INTC1 114 DC_COMP
7 TDO 43 VCC 79 SEGM_20/INTC0 115 VCC
8 TCK 44 GND 80 SEGM_19 116 ENABLE
9 TMS 45 EMIT.0 81 SEGM_18 117 GND
10 TRST 46 EMIT.1 82 SEGM_17 118 DNIN
11 D_INIT 47 EMIT.2 83 SEGM_16 119 DIN
12 RSTA 48 VCC 84 SEGM_15 120 REC_1
13 /PROG 49 GND 85 SEGM_14 121 REC_2
14 SECURED 50 EMIT.3 86 SEGM_13 122 REC_3
15 /EWDG 51 EMIT.4 87 SEGM_12 123 REC_4
16 DEBUG 52 EMIT.5 88 SEGM_11 124 REC_5
17 VCC 53 EMIT.6 89 VDD 125 REC_6
18 CLKEB 54 VCC 90 VCC 126 REC_7
19 GND 55 GND 91 GND 127 REC_8
20 CLKEA 56 EMIT.7 92 SEGM_10 128 VCC
21 VCC 57 EMIT.8 93 SEGM_9 129 GND
22 GND 58 EMIT.9 94 SEGM_8 130 VRL
23 GND 59 EMIT.10 95 SEGM_7 131 VIN
24 VDEO 60 VCC 96 SEGM_6 132 VRH
25 VDEO 61 GND 97 SEGM_5 133 AVD1
26 VSSO 62 EMIT.11 98 SEGM_4 134 AVS1
27 LDO_PD 63 EMIT.12 99 SEGM_3 135 AVD2
28 VDD 64 VCC 100 SEGM_2 136 AVS2
29 GND 65 GND 101 SEGM_1 137 VCC
30 VCC 66 P3.1/TXD0 102 SEGM_0 138 GND
31 VSENSE 67 P3.0/RXD0 103 VCC 139 P5.3/MISO0
32 PSENSE 68 P4.5/MISO1/INTB3 104 GND 140 P5.2/MOSI0
33 VNR 69 P4.4/MOSI1/INTB2 105 BCKP_7/SEGM_27/INTD3 141 P5.1/SPICLK0
34 TRIAC_3 70 P4.3/SPICLK1/INTB1 106 BCKP_6/SEGM_26/INTD2 142 P5.0/SS0
35 TRIAC_2 71 P4.2/SS1/INTB0 107 BCKP_5/SEGM_25/INTD1 143 P3.5/T1
36 TRIAC_1 72 P4.1/TXD2 108 BCKP_4/SEGM_24/INTD0 144 P3.4/T0
Atmel ATPL100A [Summary datasheet]
43002A-ATPL-03/12
6
3. Mechanical Characteristics
Figure 3-1. 144-lead LQFP Package Mechanical Drawing
C
2003 FUJITSU LIMITED F144024S-c-3-3
.059
.004
+.008
0.10
+0.20
1.50
Details of "A" part
0~8
˚
(Mounting height)
0.60±0.15
(.024±.006)
0.25(.010)
(.004±.002)
0.10±0.05
(Stand off)
0.08(.003)
0.145
0.03
+.002
.001
.006
+0.05
"A"
.007±.001
0.18±0.035
M
0.07(.003)
36
37
1
LEAD No.
0.40(.016)
INDEX
144
109
108
18.00±0.20(.709±.008)SQ
SQ16.00
73
72
*
.630
.004
+.016
0.10
+0.40
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) * : These dimensions include resin protrusion.
Resin protrusion is +0.25(.010)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
Lead pitch 0.40 mm
Pa ck age width
pack age length
16.0 16.0 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 1.70 mm MAX
We ight 0.88 g

ATPL100AEK

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
Development Boards & Kits - Other Processors PL100A-AZU-Y Based-on Evaluation Kit
Lifecycle:
New from this manufacturer.
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