MCR12N

© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 6
1 Publication Order Number:
MCR12/D
MCR12DG, MCR12MG,
MCR12NG
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls, and power supplies; or wherever
half−wave silicon gate−controlled devices are needed.
Features
Blocking Voltage to 800 Volts
On−State Current Rating of 12 Amperes RMS at 80°C
High Surge Current Capability − 100 Amperes
Rugged, Economical TO−220AB Package
Glass Passivated Junctions for Reliability and Uniformity
Minimum and Maximum Values of IGT, VGT an IH Specified for
Ease of Design
High Immunity to dv/dt − 100 V/msec Minimum at 125°C
These are Pb−Free Devices
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1
)
(T
J
= −40 to 125°C, Sine Wave,
50 to 60 Hz,
Gate Open)
MCR12DG
MCR12MG
MCR12NG
V
DRM,
V
RRM
400
600
800
V
On-State RMS Current
(180° Conduction Angles; T
C
= 80°C)
I
T(RMS)
12 A
Peak Non-repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, T
J
= 125°C)
I
TSM
100 A
Circuit Fusing Consideration (t = 8.33 ms) I
2
t 41 A
2
sec
Forward Peak Gate Power
(Pulse Width 1.0 ms, T
C
= 80°C)
P
GM
5.0 W
Forward Average Gate Power
(t = 8.3 ms, T
C
= 80°C)
P
G(AV)
0.5 W
Average On-State Current
(180° Conduction Angles; T
C
= 80°C)
I
T(AV)
7.8 A
Forward Peak Gate Current
(Pulse Width 1.0 ms, T
C
= 90°C)
I
GM
2.0 A
Operating Junction Temperature Range T
J
40 to +125 °C
Storage Temperature Range T
stg
40 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; positive gate voltage shall not be
applied concurrent with negative potential on the anode. Blocking voltages
shall not be tested with a constant current source such that the voltage ratings
of the devices are exceeded.
SCRs
12 AMPERES RMS
400 thru 800 VOLTS
TO−220
CASE 221A−09
STYLE 3
1
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MARKING
DIAGRAM
A = Assembly Location
Y = Year
WW = Work Week
x = D, M, or N
G = Pb−Free Package
AKA = Diode Polarity
2
3
Device Package Shipping
ORDERING INFORMATION
MCR12DG TO−220AB
(Pb−Free)
50 Units / Rail
MCR12NG TO−220AB
(Pb−Free)
50 Units / Rail
MCR12MG TO−220AB
(Pb−Free)
50 Units / Rail
K
G
A
PIN ASSIGNMENT
1
2
3
Anode
Gate
Cathode
4
Anode
AY WW
MCR12xG
AKA
MCR12DG, MCR12MG, MCR12NG
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Case
Junction−to−Ambient
R
q
JC
R
q
JA
2.2
62.5
°C/W
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
L
260 °C
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(V
D
= Rated V
DRM
and V
RRM
; Gate Open) T
J
= 25°C
T
J
= 125°C
I
DRM
,
I
RRM
0.01
2.0
mA
ON CHARACTERISTICS
Peak Forward On−State Voltage (Note 2) (I
TM
= 24 A) V
TM
2.2 V
Gate Trigger Current (Continuous dc) (V
D
= 12 V; R
L
= 100 W)
I
GT
2.0 8.0 20 mA
Holding Current (V
D
= 12 V, Gate Open, Initiating Current = 200 mA) I
H
4.0 20 40 mA
Latch Current (V
D
= 12 V, I
G
= 20 mA) I
L
6.0 25 60 mA
Gate Trigger Voltage (Continuous dc) (V
D
= 12 V; R
L
=100 W)
V
GT
0.5 0.65 1.0 V
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(V
D
= Rated V
DRM
, Exponential Waveform, Gate Open, T
J
= 125°C)
dv/dt 100 250
V/ms
Repetitive Critical Rate of Rise of On−State Current
IPK = 50 A, Pw = 40 msec, diG/dt = 1 A/msec, Igt = 50 mA
di/dt 50
A/ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Indicates Pulse Test: Pulse Width v 2.0 ms, Duty Cycle v 2%.
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol Parameter
V
DRM
Peak Repetitive Off State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak On State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
Forward Blocking Region
I
RRM
at V
RRM
(off state)
90°
180°
Figure 1. Typical RMS Current Derating Figure 2. On−State Power Dissipation
80
I
T(RMS)
, RMS ON−STATE CURRENT (AMPS)
125
120
I
T(AV)
, AVERAGE ON−STATE CURRENT (AMPS)
380
8
4
2
0
T
C
, CASE TEMPERATURE ( C)
P
115
105
12 3 12
6
10
20
°
, AVERAGE POWER DISSIPATION (WATTS)
(AV)
dc
180°90°
60°
dc
30°
545
110
4
100
90
95
67
12
14
671291011
30°
12
910
11
16
18
MCR12DG, MCR12MG, MCR12NG
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3
Figure 3. Typical On−State Characteristics Figure 4. Typical Gate Trigger Current versus
Junction Temperature
3.00.5
V
T
, INSTANTANEOUS ON−STATE VOLTAGE (VOLTS)
100
10
1
0.1
T
J
, JUNCTION TEMPERATURE (°C)
−10−40
20
2
0
2.5
I
GATE TRIGGER CURRENT (mA)
1.0 2.0 20 50 80 125
, INSTANTANEOUS ON-STATE CURRENT (AMPS)
T
MAXIMUM @ T
J
= 25°C
MAXIMUM @ T
J
= 125°C
1.5 5356595
−25
110
4
6
8
10
12
14
16
18
Figure 5. Typical Holding Current versus
Junction Temperature
Figure 6. Typical Gate Trigger Voltage versus
Junction Temperature
−25 20−40
T
J
, JUNCTION TEMPERATURE (°C)
10
T
J
, JUNCTION TEMPERATURE (°C)
−25 65−40
0.2
205
, HOLDING CURRENT (mA)I
H
50 11065 5 12535 50
V
GT
, GATE TRIGGER VOLTAGE (VOLTS)
80
1
1.0
−10
35
95
100
−10 9580
125
0.3
0.4
0.5
0.6
0.7
0.8
0.9
110
Figure 7. Typical Latching Current versus
Junction Temperature
65 125−40
T
J
, JUNCTION TEMPERATURE (°C)
I
L
, LATCHING CURRENT (mA)
10
1
−25 5 20 50 95
100
−10 35 80 110

MCR12N

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
SCRs 800V 12A
Lifecycle:
New from this manufacturer.
Delivery:
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