MP86963 –20A, 27V INTELLI-PHASE
TM
SOLUTION INTEGRATED HS/LS FETS AND DRIVER IN A 5X5mm QFN
MP86963 Rev.1.22 www.MonolithicPower.com 2
12/26/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature(T
A
)
MP86963DUT 5x5 TQFN 86963UT
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP86963DUT–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP86963DUT–LF–Z)
PACKAGE REFERENCE
EXPOSED PAD
CONNECT TO PIN
PIN 1 ID
GND
GND
GND
GND
GND
GND
GND
GND
GND
N/C
VCC
EN
SYNC
PWM
VCC IO
BST
IN
AGND
18
17
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
9
GND
GND
GND
GND
SW
IN
IN
IN
IN
SW
SW
SW
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage V
IN
....................................... 27V
V
SW
(DC)
.................................-0.3V to V
IN
+0.3V
V
SW
(20ns)
....................................-3V to V
IN
+3V
V
BST
...................................................... V
SW
+ 6V
All Other Pins..................................-0.3V to +6V
Continuous Power Dissipation (T
A
= +25°C)
(2)
............................................................. 3.8W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
...........................4.5V to 21V
V
CC
Driver Voltage………………….4.5V to 5.5V
Operating Junct. Temp (T
J
)...... -40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
5x5 TQFN ............................... 33 ....... 8.... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/ θ
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
