AD5821
Rev. 0 | Page 3 of 16
SPECIFICATIONS
V
DD
= 2.7 V to 5.5 V, AGND = DGND = 0 V, load resistance R
L
= 25 Ω connected to V
DD
; all specifications T
MIN
to T
MAX
,
unless otherwise noted.
Table 1.
B Version
1
Parameter Min Typ Max Unit Test Conditions/Comments
DC PERFORMANCE
V
DD
= 3.6 V to 4.5 V; device operates over 2.7 V to 5.5 V
with reduced performance
Resolution 10 Bits 117 μA/LSB
Relative Accuracy
2
±1.5 ±4 LSB
Differential Nonlinearity
2, 3
±1 LSB Guaranteed monotonic over all codes
Zero-Code Error
2, 4
0 1 5 mA All 0s loaded to DAC
Offset Error @ Code 16
2
0.5 mA
Gain Error
2
±0.6 % of FSR @ 25°C
Offset Error Drift
4, 5
10 μA/°C
Gain Error Drift
2, 5
±0.2 ±0.5 LSB/°C
OUTPUT CHARACTERISTICS
Minimum Sink Current
4
3 mA
Maximum Sink Current 120 mA
Output Current During XSHUTDOWN 80 nA XSHUTDOWN = 0
Output Compliance
5
0.6 V
DD
V
Output voltage range over which maximum 120 mA
sink current is available
Output Compliance
5
0.48 V
DD
V
Output voltage range over which 90 mA sink current
is available
Power-Up Time 20 μs To 10% of FS, coming out of power-down mode; V
DD
= 5 V
LOGIC INPUTS (XSHUTDOWN)
5
Input Current ±1 μA
Input Low Voltage, V
INL
0.54 V V
DD
= 2.7 V to 5.5 V
Input High Voltage, V
INH
1.3 V V
DD
= 2.7 V to 5.5 V
Pin Capacitance 3 pF
LOGIC INPUTS (SCL, SDA)
5
Input Low Voltage, V
INL
−0.3 +0.54 V V
DD
= 2.7 V to 3.6 V
Input High Voltage, V
INH
1.26 V
DD
+ 0.3 V V
DD
= 2.7 V to 3.6 V
Input Low Voltage, V
INL
−0.3 +0.54 V V
DD
= 3.6 V to 5.5 V
Input High Voltage, V
INH
1.4 V
DD
+ 0.3 V V
DD
= 3.6 V to 5.5 V
Input Leakage Current, I
IN
±1 μA V
IN
= 0 V to V
DD
Input Hysteresis, V
HYST
0.05 V
DD
V
Digital Input Capacitance, C
IN
6 pF
Glitch Rejection
6
50 ns Pulse width of spike suppressed
POWER REQUIREMENTS
V
DD
2.7 5.5 V
I
DD
(Normal Mode) I
DD
specification is valid for all DAC codes
V
DD
= 2.7 V to 3.6 V 2.5 4 mA V
INH
= 1.8 V, V
INL
= GND, V
DD
= 3.6 V
I
DD
(Power-Down Mode)
7
0.5 μA V
INH
= 1.8 V, V
INL
= GND
1
Temperature range is as follows: B Version = −30°C to +85°C.
2
See the section. Terminology
3
Linearity is tested using a reduced code range: Code 32 to Code 1023.
4
To achieve near zero output current, use the power-down feature.
5
Guaranteed by design and characterization; not production tested. XSHUTDOWN is active low. SDA and SCL pull-up resistors are tied to 1.8 V.
6
Input filtering on both the SCL and the SDA inputs suppresses noise spikes that are less than 50 ns.
7
XSHUTDOWN is active low.
AD5821
Rev. 0 | Page 4 of 16
AC SPECIFICATIONS
V
DD
= 2.7 V to 5.5 V, AGND = DGND = 0 V, load resistance R
L
= 25 Ω connected to V
DD
, unless otherwise noted.
Table 2.
B Version
1, 2
Parameter Min Typ Max Unit Test Conditions/Comments
Output Current Settling Time 250 μs V
DD
= 3.6 V, R
L
= 25 Ω, L
L
= 680 μH, ¼ scale to ¾ scale change (0x100 to 0x300)
Slew Rate 0.3 mA/μs
Major Code Change Glitch Impulse 0.15 nA-s 1 LSB change around major carry
Digital Feedthrough
3
0.06 nA-s
1
Temperature range is as follows: B Version = −40°C to +85°C.
2
Guaranteed by design and characterization; not production tested.
3
See the section. Terminology
TIMING SPECIFICATIONS
V
DD
= 2.7 V to 3.6 V. All specifications T
MIN
to T
MAX
, unless otherwise noted.
Table 3.
B Version
Parameter
1
Limit at T
MIN
, T
MAX
Unit Description
f
SCL
400 kHz max SCL clock frequency
t
1
2.5 μs min SCL cycle time
t
2
0.6 μs min t
HIGH
, SCL high time
t
3
1.3 μs min t
LOW
, SCL low time
t
4
0.6 μs min t
HD, STA
, start/repeated start condition hold time
t
5
100 ns min t
SU, DAT
, data setup time
t
6
2
0.9 μs max t
HD, DAT
, data hold time
0 μs min
t
7
0.6 μs min t
SU, STA
, setup time for repeated start
t
8
0.6 μs min t
SU, STO
, stop condition setup time
t
9
1.3 μs min t
BUF
, bus free time between a stop condition and a start condition
t
10
300 ns max t
R,
rise time of both SCL and SDA when receiving
0 ns min May be CMOS driven
t
11
250 ns max t
F
, fall time of SDA when receiving
300 ns max t
F
, fall time of both SCL and SDA when transmitting
20 + 0.1 C
B
3
ns min
C
B
400 pF max Capacitive load for each bus line
1
Guaranteed by design and characterization; not production tested.
2
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VINH MIN of the SCL signal) to bridge the undefined region of the SCL falling edge.
3
C
B
is the total capacitance of one bus line in pF. t
R
and t
F
are measured between 0.3 V
DD
and 0.7 V
DD
.
Timing Diagram
05950-002
S
DA
t
9
SCL
t
3
t
10
t
11
t
4
t
4
t
6
t
2
t
5
t
7
t
1
t
8
START
CONDITION
REPEATED
START
CONDITION
STOP
CONDITION
Figure 2. 2-Wire Serial Interface Timing Diagram
AD5821
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to AGND –0.3 V to +5.5 V
V
DD
to DGND –0.3 V to V
DD
+ 0.3 V
AGND to DGND –0.3 V to +0.3 V
SCL, SDA to DGND –0.3 V to V
DD
+ 0.3 V
XSHUTDOWN to DGND –0.3 V to V
DD
+ 0.3 V
I
SINK
to AGND –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −30°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
MAX
) 150°C
WLFCSP Power Dissipation (T
J
MAX
T
A
)/θ
JA
θ
JA
Thermal Impedance
1
Mounted on 4-Layer Board 95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperature
2
260°C (±5°C)
1
To achieve the optimum θ
JA
, it is recommended that the AD5821
be soldered on a 4-layer board.
2
As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION

AD5821BCBZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
IC DAC 10BIT A-OUT 9WLCSP
Lifecycle:
New from this manufacturer.
Delivery:
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