LQW18AN8N4G8ZD Datasheet LQW18ANR27G8ZD, LQW18AN23NJ8ZD, LQW18ANR18J8ZD | P10-P12

SpecNo.JELF243A-9133-01 P.10/12

MURATA MFG.CO., LTD

Reference Only

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating

150°C～180°C 、90s±30s

Heating

above 220°C､30s～60s above 230°C､60s max.

Peak temperature

245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

10.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter

φ3mm max.

Soldering time 3(+1,-0)s

Time 2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

10.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T：thickness of product

10.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A＞C＞B ≅ D.

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s∼60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

Recommendable(t)

Upper Limit

⇔

Recommendable(t)

Upper Limit

⇔

SpecNo.JELF243A-9133-01 P.11/12

MURATA MFG.CO., LTD

Reference Only

10.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning Please contact us.

10.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention in when you select resin in case of coating/molding the products

with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

10.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

10.10 Notice of product handling at mounting

In some mounting machines,when picking up components support pin pushes up the components from the

bottom of base tape. In this case, please remove the support pin. The support pin may damage the components

and break wire.

In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser

recognition. (There is no problem with the permeation and reflection type.)

10.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

SpecNo.JELF243A-9133-01 P.12/12

MURATA MFG.CO., LTD

Reference Only

10.12 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause

oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the

core and the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity,

dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

11.

! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

Zm=

， Zx=

(3) Thus,the relation between Zx and Zm is following;

Zx= α

Zm-β where, α= D / A =1

1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm : measured impedance of short chip

Zssa: residual impedance of short chip (0.771nH)

Yom: measured admittance when opening the fixture

(4) Lx shall be calculated with the following equation.

A B

C D

Lx=

Im(Zx)

, Qx =

Im(Zx) Lx : Inductance of chip coil

2πf Re(Zx) Qx : Q of chip coil

f : Measuring frequency

ProductTest fixtureTest Head

P1-P3 P4-P6 P7-P9 P10-P12

LQW18AN8N4G8ZD

Mfr. #:

Buy LQW18AN8N4G8ZD

Manufacturer:

Murata Electronics

Description:

Fixed Inductors

Lifecycle:

New from this manufacturer.

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LQW18AN8N4G8ZD

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