SpecNo.JELF243A-9133-01 P.9/12
MURATA MFG.CO., LTD
Reference Only
9. ！ Caution
9.1 Rating
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.2 Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
9.4 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
(in mm)
10.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
10.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
a 0.86
b 2.00
c 1.15
a
b
c
Chip Coil
Solder resist
Land
