NTMFS5C646NLT1G

© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 4
1 Publication Order Number:
NTMFS5C646NL/D
NTMFS5C646NL
Power MOSFET
60 V, 4.7 mW, 93 A, Single N−Channel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 3)
Steady
State
T
C
= 25°C
I
D
93
A
T
C
= 100°C 65
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C
P
D
79
W
T
C
= 100°C 40
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
20
A
T
A
= 100°C 14
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.7
W
T
A
= 100°C 1.8
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
750 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+175
°C
Source Current (Body Diode) I
S
100 A
Single Pulse Drain−to−Source Avalanche
Energy (I
L(pk)
= 5 A)
E
AS
185 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Case − Steady State
R
q
JC
1.9
°C/W
Junction−to−Ambient − Steady State (Note 2)
R
q
JA
41
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
5C646L = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
5C646L
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
60 V
4.7 mW @ 10 V
93 A
6.3 mW @ 4.5 V
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5)
S
S
S
G
D
D
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
NTMFS5C646NL
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2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
15.5
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 60 V
T
J
= 25 °C 10
mA
T
J
= 125°C 250
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.2 2.0 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
−4.9 mV/°C
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V I
D
= 50 A 3.8 4.7
mW
V
GS
= 4.5 V I
D
= 50 A 5.0 6.3
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 50 A 105 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
2164
pF
Output Capacitance C
OSS
900
Reverse Transfer Capacitance C
RSS
17
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 30 V; I
D
= 25 A 15.7
nC
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 30 V; I
D
= 25 A 33.7
Threshold Gate Charge Q
G(TH)
V
GS
= 4.5 V, V
DS
= 30 V; I
D
= 25 A
1.5
Gate−to−Source Charge Q
GS
5.6
Gate−to−Drain Charge Q
GD
5.1
Plateau Voltage V
GP
2.8 V
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 30 V,
I
D
= 25 A, R
G
= 2.5 W
10.4
ns
Rise Time t
r
14.9
Turn−Off Delay Time t
d(OFF)
23.6
Fall Time t
f
5.1
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 50 A
T
J
= 25°C 0.88 1.2
V
T
J
= 125°C 0.78
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 50 A
40.9
ns
Charge Time t
a
20.8
Discharge Time t
b
20.1
Reverse Recovery Charge Q
RR
32 nC
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NTMFS5C646NL
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3
TYPICAL CHARACTERISTICS
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V) V
GS
, GATE−TO−SOURCE VOLTAGE (V)
3.02.52.01.51.00.50
0
20
40
60
80
100
120
140
4.03.02.52.01.51.00.50
0
20
40
60
80
100
120
140
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
, GATE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
109876543
3
4
5
6
7
8
130110 1509070503010
3
4
5
6
7
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
17512510075250−25−50
0.6
0.8
1.0
1.2
1.4
1.6
2.0
55453525155
10
100
1000
10,000
100,000
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAIN−TO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
2.8 V
3.0 V
3.2 V
3.4 V
3.6 V
10 V to
4.5 V
3.8 V
3.5
T
J
= 125°C
T
J
= 25°C
T
J
= −55°C
T
J
= 25°C
I
D
= 50 A
T
J
= 25°C
V
GS
= 4.5 V
V
GS
= 10 V
V
GS
= 10 V
I
D
= 40 A
50
T
J
= 125°C
T
J
= 85°C
30
50
70
90
110
130
150
10
150
1.8

NTMFS5C646NLT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET SO8FL 60V 92A 4.5MOH
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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