D2TO20
www.vishay.com
Vishay Sfernice
Revision: 29-Mar-16
2
Document Number: 51055
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SPECIAL FEATURES
Resistance Values 0.010 0.045 0.1 0.5
Tolerances ± 1 % at ± 10 %
Requirement Temperature Coefficient (TCR)
(-55 °C +150 °C)
IEC 60115-1
± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
2 Pr 5 s for R < 2
1.5 Pr 5 s for R 2
US < 1.5 UL
± (0.25 % + 0.005 )
Load Life
IEC 60115-1
1000 h, 90/30 Pr at +25 °C
± (1 % + 0.005 )
High Temperature Exposure
AEC-Q200 REV D conditions:
MIL-STD-202 method 108
1000 h, +175 °C, unpowered
± (0.25 % + 0.005 )
Temperature Cycling
Pre-conditioning 3 reflows according
JESTD020D
IEC 60068-2-14 test Na
1000 cycles, -55 °C/+175 °C
Dwell time - 15 min
± (0.5 % + 0.005 )
Moisture Resistance
AEC-Q200 REV D conditions:
MIL-STD-202 method 106
10 cycles, 24 h, unpowered
± (0.5 % + 0.005 )
Biased Humidity
AEC-Q200 REV D conditions:
MIL-STD-202 method 103
1000 h, 85°C, 85 % RH
± (1 % + 0.005 )
Operational Life
AEC-Q200 REV D conditions:
Pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
2000 h, 90/30, powered, +125 °C
± (1 % + 0.005 )
ESD Human Body Model
AEC-Q200 REV D conditions:
AEC-Q200-002
25 kV
AD
± (0.5 % + 0.005 )
Vibration
AEC-Q200 REV D conditions:
MIL-STD-202 method 204
5 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
± (0.5 % + 0.005 )
Mechanical Shock
AEC-Q200 REV D conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
± (0.5 % + 0.005 )
Board Flex
AEC-Q200 REV D conditions:
AEC-Q200-005
Bending 2 mm/60 s
± (0.25 % + 0.01 )
Terminal Strength
AEC-Q200 REV D conditions:
AEC-Q200-006
1.8 kgf/60 s
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder bath method: 270 °C/10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL)
IPC/JEDEC
®
J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ pass requirements of TCR
overload and dielectric strength after MSL