Narrow pitch connectors A4US (0.4mm pitch)
–6–
ACCTB4E 201409-T
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
3. See the common “NOTES FOR
USE” on the next page for other points
to be noted.
• 0.8 mm Socket
Recommended PC board pattern
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
• Socket (Mated height: 1.0 mm and 1.5
mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
• Header (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 73%)
0.40±0.03
0.23±0.03
0.80±0.03
1.45±0.03
C0.30
(0.45)
2.40±0.01
1.04±0.03
(0.68)
0.20±0.03
1.50±0.03
: Insulation area
0.40±0.01
0.20±0.01
0.80±0.01
1.45±0.01
C0.30
(0.36)
1.58±0.01
2.30±0.01
2.40±0.01
1.04±0.01
(0.68)
C0.30
2.60±0.03
0.20±0.03
1.60±0.03
1.04±0.03
(0.78)
(0.50)
0.40±0.03
0.80±0.03
1.45±0.03
0.23±0.03
: Insulatin area
C0.30
1.70±0.01
2.50±0.01
2.60±0.01
1.04±0.01
(0.78)
(0.40)
0.40±0.01
0.20±0.01
0.80±0.01
1.45±0.01
For other details, please verify with the
product specification sheets.
2.20±0.03
0.90±0.03
2.20±0.03
0.50±0.03
(0.85)
(0.65)
0.40±0.03
0.80±0.03
0.28±0.03
0.23±0.03
0.80±0.01
0.23±0.01
2.07±0.01
(0.76)
0.55±0.01
2.07±0.01
1.03±0.01
(0.52)
0.40±0.01
0.20±0.01
