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IPC100N04S5L1R9ATMA1
P1-P3
P4-P6
P7-P9
IPC1
00N0
4S5
L-1R
9
OptiMOS
™
-5 Pow
er-Transistor
Features
• OptiMOS™ - power MOSFET for automotive applications
• N-channel - Enhancement mode - Logic Level
• AEC Q101 quali
fied
• MSL1 up to 260°
C peak reflow
• 175°C operating te
mperature
• Green Product (RoHS compliant)
• 100% Avalan
che tested
Maximum ratings,
at
T
j
=25 °C, unless otherw
ise specified
Parameter
Symbol
Conditions
Unit
Continuous drain current
1)
I
D
T
C
=25°C,
V
GS
=10V
100
A
T
C
=100°C,
V
GS
=10V
2)
100
Pulsed drain current
2)
I
D,pulse
T
C
=25°C
400
Avalanche energy
, single pulse
2)
E
AS
I
D
=50A
130
mJ
Avalanche current, singl
e pulse
I
AS
-
100
A
Gate source voltage
V
GS
-
±16
V
Power dissipati
on
P
tot
T
C
=25°C
100
W
Operating and storage temperature
T
j
,
T
stg
-
-55 ... +175
°C
Value
V
DS
40
V
R
DS(on),max
1.9
m
W
I
D
100
A
Product Summary
Type
Package
Marking
IPC100N04S5L-1R9
PG
-T
DSON-8-
34
5N04L1R9
1
1
PG
-T
DSON-8-
34
Rev. 1.2
page 1
2016-12-06
IPC1
00N0
4S5L-1R
9
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Thermal characteristics
2)
Therm
al resistance, junction - case
R
thJC
-
-
-
1.5
K/W
Therm
al resistance, junction -
ambient
R
thJA
6 cm
2
cooling area
3)
-
-
50
Electrical characteristics,
at
T
j
=25 °C, unless otherw
ise spec
ified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0V,
I
D
= 1mA
40
-
-
V
Gate threshold voltag
e
V
GS(th)
V
DS
=
V
GS
,
I
D
=50µA
1.2
1.6
2.0
Zero gate voltage d
rain current
I
DSS
V
DS
=40V,
V
GS
=0V,
T
j
=25°C
-
-
1
µA
V
DS
=40V,
V
GS
=0V,
T
j
=125°C
2)
-
-
100
Gate-source leakage current
I
GSS
V
GS
=16V,
V
DS
=0V
-
-
100
nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5V,
I
D
=50A
-
1.8
2.5
m
W
V
GS
=10V,
I
D
=50A
-
1.4
1.9
Values
Rev. 1.2
page 2
2016-12-06
IPC1
00N0
4S5L-1R
9
Parameter
Symbol
Conditions
Unit
min.
typ.
max.
Dynamic characteristics
2)
Input capacitance
C
iss
-
3240
4310
pF
Output capacitance
C
oss
-
730
970
Reverse transfer capacitance
C
rss
-
48
72
Turn-on delay
time
t
d(on)
-
5
-
ns
Rise time
t
r
-
5
-
Turn-of
f delay
tim
e
t
d(off)
-
29
-
Fall time
t
f
-
22
-
Gate Charge Characteristics
2)
Gate to source charge
Q
gs
-
9
12
nC
Gate to drain charge
Q
gd
-
13
19
Gate charge total
Q
g
-
61
81
Gate plateau vol
tage
V
plateau
-
2.7
-
V
Reverse Diode
Diode continous forward current
2)
I
S
-
-
100
A
Diode pulse current
2)
I
S,pulse
-
-
400
Diode forward voltag
e
V
SD
V
GS
=0V,
I
F
=50A,
T
j
=25°C
-
0.8
1.1
V
Reverse recovery
tim
e
2)
t
rr
V
R
=20V,
I
F
=100A,
d
i
F
/d
t
=100A/µs
-
51
-
ns
Reverse recovery
c
harge
2)
Q
rr
-
54
-
nC
3)
Device on 40 m
m x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm
thick) co
pper area for dra
in
connecti
on. PCB is vertical
in still
air.
1)
Current is l
imited by pac
kage; with an
R
thJC
= 1.5 K/W
the chip i
s able to c
arry 160A at 25°C.
T
C
=25°C
2)
The parameter i
s not subje
ct to produc
tion test- verifi
ed by design/c
haracterizatio
n.
Values
V
GS
=0V,
V
DS
=25V,
f
=1MHz
V
DD
=20V,
V
GS
=10V,
I
D
=100A,
R
G
=3.5
W
V
DD
=32V,
I
D
=100A,
V
GS
=0 to 10V
Rev. 1.2
page 3
2016-12-06
P1-P3
P4-P6
P7-P9
IPC100N04S5L1R9ATMA1
Mfr. #:
Buy IPC100N04S5L1R9ATMA1
Manufacturer:
Infineon Technologies
Description:
MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
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IPC100N04S5L1R9ATMA1