Data Sheet
October 5, 2009
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 17
Surface Mount Information (continued)
X
21mm
(0.84in)
14mm
(0.57in)
Note: All dimensions in mm.
Figure 22. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Reflow Soldering Information
The HC family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The surface mountable modules in the HC family use
our newest SMT technology called “Column Pin” (CP)
connectors. Fig 23 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
HC Board
Insulator
Solder Ball
End assembly PCB
Figure 23. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183
o
C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4
o
Cs
-1
So ak zo ne
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Coo ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 24. Recommended Reflow Profile
