ICS844246DI Data Sheet FEMTOCLOCK
®
CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER w/FANOUT BUFFER
ICS844246DGI REVISION A NOVEMBER 28, 2012 13 ©2012 Integrated Device Technology, Inc.
Schematic Layout
Figure 4 shows an example of ICS844246DI-08 application
schematic. The schematic example focuses on functional
connections and is not configuration specific. Refer to the pin
description and functional tables in the datasheet to ensure the
logic control inputs are properly set. Input and output
terminations shown are intended as examples only and may
not represent the exact user configuration.
In this example an 18pF parallel resonant 25MHz crystal is used with
load caps C7 = C6 = 22pF. The load caps are recommended for
frequency accuracy, but these may be adjusted for different board
layouts. Crystals with different load capacities may be used, but the
load capacitors will have to be changed accordingly. If different
crystal types are used, please consult IDT for recommendations.
The schematic example shows two different LVDS output
terminations; the standard termination 100
shunt termination for an
LVDS compliant receiver and an AC coupled termination for a
non-LVDS differential receiver. The AC coupled termination requires
that the designer select the values of R4 and R6 in order to center the
LVDS swing within the common mode range of the receiver. In
addition the designer must make sure that the target receiver will
operate reliably with the LVDS swing, which is reduced relative to
other logic families such as HCSL or LVPECL.
As with any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance,
power supply isolation is required. The ICS844246DI provides
separate V
DD
, V
DDA
and V
DDO
pins to isolate any high speed
switching noise at the outputs from coupling into the internal PLL.
In order to achieve the best possible filtering, it is recommended that
the placement of the filter components be on the device side of the
PCB as close to the power pins as possible. If space is limited, the
0.1uF capacitor in each power pin filter should be placed on the
device side of the PCB and the other components can be placed on
the opposite side.
Power supply filter recommendations are a general guideline to be
used for reducing external noise from coupling into the devices. The
filter performance is designed for wide range of noise frequencies.
This low-pass filter starts to attenuate noise at approximately 10kHz.
If a specific frequency noise component is known, such as switching
power supply frequencies, it is recommended that component values
be adjusted and if required, additional filtering be added. Additionally,
good general design practices for power plane voltage stability
suggests adding bulk capacitances in the local area of all devices.
ICS844246DI Data Sheet FEMTOCLOCK
®
CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER w/FANOUT BUFFER
ICS844246DGI REVISION A NOVEMBER 28, 2012 14 ©2012 Integrated Device Technology, Inc.
Figure 4. ICS844246DI Application Schematic
Place 0.1uF bypass caps
directly adjacent to the
corresponding VDD and VDDA
pins.
VCC_Receiver
Receiver
+
-
(Select R4 and R6 to center the LVDS swing in the
common mode center of the Receiver.)
Zo = 50 Ohm
Zo = 50 Ohm
R2
50
R3
50
C10
0.01uF
C12
0.1u
Q5
C13
0.1u
nQ5
R4
R6
Alternate AC coupled LVDS Termination
to non-LVDS Receiver.
Q0
nQ1
Q1
nQ2
Q2
Q3
nQ3
nQ4
Q4
LVDS Termination
VD D
C1
0.1uF
3.3V
C2
10uF
FB1
BLM18BB221SN1
12
R5 10
C3
10uF
C4
0.1uF
C5
0.1uF
U1
PLL_BYPASS
9
FB_SEL
12
XTAL_IN
13
XTAL_OU T
14
N_SEL0
15
N_SEL1
18
nQ2
3
Q2
4
nQ1
5
Q1
6
nQ0
7
Q0
8
nQ5
19
Q5
20
nQ4
21
Q4
22
nQ3
23
Q3
24
VDDO
1
VDDO
2
VDDA
10
VDD
11
GN D
16
GND
17
EPAD
25
C6
22pF
C7
22pF
X1
25MHz (18pf )
VDD
To Logic
Input
pins
VDD
RU2
Not Install
RU1
1K
RD2
1K
To Logic
Input
pins
RD1
Not Install
Set Logic
Input to '1'
Set Logic
Input to '0'
Logic Control Input Examples
VDDA
LVDS Receiv er
+
-
Zo = 50 Ohm
Zo = 50 Ohm
R1
100
nQ0
C14
0.1uF
N_SEL1
N_SEL0
FB_SEL
PLL_BYPASS
3.3V
C8
0.1uF
C9
10uF
FB2
BLM18BB221SN1
12
Place 0.1uF bypass cap directly
adjacent to the VDDO pins.
C11
0.1uF
ICS844246DI Data Sheet FEMTOCLOCK
®
CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER w/FANOUT BUFFER
ICS844246DGI REVISION A NOVEMBER 28, 2012 15 ©2012 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS844246DI.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS844246DI is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (170mA + 10mA) = 623.7mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 100mA = 346.5mW
Total Power_
MAX
= 623.7mW + 346.5mW = 970.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 32.1°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.970W * 32.1°C/W = 116.1°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance
JA
for 24 Lead TSSOP, E-Pad Forced Convection
JA
by Velocity
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 32.1°C/W 25.5°C/W 24.0°C/W

844246DGILFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Synthesizer / Jitter Cleaner FemtoClock LVDS Int Fanout Buffer
Lifecycle:
New from this manufacturer.
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