DLW5BTZ251TQ2L Datasheet DLW5BTZ251TQ2L, DLW5BTZ102TQ2L, DLW5BTZ142TQ2L | P7-P9

Spec. No. JEFL243C-9108D-01 P 7/10

MURATA MFG CO., LTD.

14.Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

14.1. Flux and Solder

Flux

Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),

but not highly acidic flux

(with Halogen content exceeding 0.2(wt)% conversion to chlorine).

Do not use water-soluble flux.

Solder Use Sn-3.0Ag-0.5Cu solder

14.2. Assembling

< Exclusive use of Reflow soldering >

Flow soldering may cause deterioration in insulation resistance.

So,reflow soldering shall be applied for this product.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and

ceramic surface is limited to 100°C max. Also cooling into solvent after soldering

should be in such a way that the temperature difference is limited to 100°C max.

Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.

14.3. Cleaning Conditions

Do not clean after soldering. If cleaning, please contact us.

14.4. Resin coating

The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An

open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under

some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful

attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,

please make sure no reliability issue is observed by evaluating products mounted on your board.

14.5. Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be location the sideways

direction (Length:a

<b) to the mechanical

stress.

〈

Poor example

〉

〈

Good example

〉

Spec. No. JEFL243C-9108D-01 P 8/10

MURATA MFG CO., LTD.

Pick- up nozzle

Support pin

P.C.B.

Product

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from the board separation surface. A > C

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3)

Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

14.6. Attention Regarding P.C.B. Design

< The Arrangement of Products >

•P.C.B. shall be designed so that products are

far from the portion of perforation.

•The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the case

of P.C.B. separation.

•Products shall not be arranged on the

line of a series of holes when there

are big holes in P.C.B.

(Because the stress concentrate on the

line of holes.)

< Products Placing >

•Support pins shall be set under P.C.B.

to prevent causing a warp to P.C.B.

during placing the products on the other

side of P.C.B..

< P.C.B. Separation >

•P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

○

P.C.B.

Portion of

Perforation

Portion of

Perforation

Product

P.C.B.

Hole

○

Perforation

Slit

Screw Hole

Recommended

Spec. No. JEFL243C-9108D-01 P 9/10

MURATA MFG CO., LTD.

14.7. Standard Land Dimensions

14.8. Reflow Soldering

(1) Standard printing pattern of solder paste

・Standard thickness of solder paste

should be 150 to 200µm.

Solderability is subject to reflow condition

and thermal conductivity.

Please make sure that your product has been evaluated

in view of your specifications with our product being

mounted to your product.

・Use the solder paste printing pattern of the

right pattern.

・For the resist and copper foil pattern,

use standard land dimensions.

・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.

(2) Soldering Conditions

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 250±3°C 260°C, 10s

Cycle of reflow 2 times 2 times

0.9

2.9

5.5

1.3

3.3

4.7

(in mm)

150

90s±30s

Time（ｓ）

250±3℃

Tem

(℃)

220℃

30～60s

180

260℃

230℃

60s max.

Limit Profile

Standard Profile

0.9

2.9

5.5

1.3

3.3

4.7

①②③④

indicates terminal number

①②

④③

Resist

Copper foil pattern

No pattern

(in mm)

P1-P3 P4-P6 P7-P9 P10-P10

DLW5BTZ251TQ2L

Mfr. #:

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Manufacturer:

Murata Electronics

Description:

Common Mode Chokes / Filters 250ohms@100MHz 3.0A 0.02ohms AEC-Q200

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DLW5BTZ251TQ2L

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