TCMT1600, TCMT4600, TCMT4606
www.vishay.com
Vishay Semiconductors
Rev. 2.6, 21-Jul-15
9
Document Number: 83512
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 19 - TTape and Reel Packing for TCMT460X (2000 parts per reel)
Fig. 20 - TTape and Reel Packing for TCMT460XT0 (2000 parts per reel)
SOLDER PROFILES
Fig. 21 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T
amb
< 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
18427
technical drawings
according to DIN
specification
7.4
12
2.2
24
2.6
0.3
16
7.5
10.6
Ø 1.55
1.75
Ø 1.6
5°
Direction of pulling out
18427_1
technical drawings
according to DIN
specification
7.4
12
2.2
2
4
2.6
0.3
16
7.5
10.6
Ø 1.55
1.75
Ø 1.6
5°
Direction of pulling out
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C
