6
ACPL-847 Package Outline - Option 300
DIMENSIONS IN [MILLIMETERS] AND INCHES
0.30 ±0.01
7.62 ±0.30
0.01
0.26
0.40 ±0.01
10.16 ±0.30
0.039 ±0.010
1 ±0.25
0.10 ±0.01
2.54 ±0.25
0.781 ±0.020
19.84 ±0.50
0.05 ±0.00
1.20 ±0.10
0.01 ±0.01
0.35 ±0.25
0.138 ±0.020
3.50 ±0.50
0.256 ±0.020
6.50 ±0.50
A 847
YYWW
DATE CODE
PIN ONE DOT
LEAD FREE
RANK
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
2. When using another soldering method such as
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non-halide flux should be used.
30 seconds
60 ~ 150 sec 90sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260 °C (Peak Temperature)
217°C
Time (sec)
Temperature (
°C)
ACPL-847 Package Outline - Option W00
DIMENSIONS IN [MILLIMETERS] AND INCHES
0.40 ±0.02
10.16 ±0.50
0.272 ±0.020
6.90 ±0.50
0.30 ±0.01
7.62 ±0.30
0.10 ±0.01
2.54 ±0.25
0.11 ±0.02
2.80 ±0.50
0.781 ±0.020
19.84 ±0.50
0.138 ±0.020
3.50 ±0.50
0.02 ±0.00
0.50 ±0.10
0.256 ±0.020
6.50 ±0.50
A 847
YYWW
DATE CODE
LEAD FREE
PIN ONE DOT
RANK
