MC100LVEL51DTR2G

© Semiconductor Components Industries, LLC, 2016
July, 2016 Rev. 7
1 Publication Order Number:
MC100LVEL51/D
MC100LVEL51
3.3VECL Differential Clock
D Flip‐Flop
Description
The MC100LVEL51 is a differential clock D flip-flop with reset. The
device is functionally equivalent to the EL51 device, but operates from
a 3.3 V supply. With propagation delays and output transition times
essentially equal to the EL51, the LVEL51 is ideally suited for those
applications which require the ultimate in AC performance at 3.3 V V
CC
.
The reset input is an asynchronous, level triggered signal. Data enters
the master portion of the flip-flop when the clock is LOW and is
transferred to the slave, and thus the outputs, upon a positive transition of
the clock. The differential clock inputs of the LVEL51 allow the device to
be used as a negative edge triggered flip-flop.
The differential input employs clamp circuitry to maintain stability
under open input conditions. When left open, the CLK input will be
pulled down to V
EE
and the CLK input will be biased at V
CC
/2.
Features
475 ps Propagation Delay
2.8 GHz Toggle Frequency
ESD Protection: > 4 kV Human Body Model,
> 200 V Machine Model
The 100 Series Contains Temperature Compensation
PECL Mode Operating Range: V
CC
= 3.0 V to 3.8 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= 3.0 V to 3.8 V
Internal Input Pulldown Resistors
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level
Level 1 for SOIC8 NB
Level 3 for TSSOP8
Level 1 for DFN8
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 114 devices
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
*For additional marking information, refer to
Application Note AND8002/D
.
MARKING DIAGRAMS*
KV51
ALYWG
G
SOIC8 NB
D SUFFIX
CASE 751
1
8
TSSOP8
DT SUFFIX
CASE 948R
1
8
1
8
www.onsemi.com
KVL51
ALYW
G
1
8
DFN8
MN SUFFIX
CASE 506AA
4G M G
G
14
(Note: Microdot may be in either location)
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M
= Date Code
G = Pb-Free Package
SOIC8 TSSOP8 DFN8
For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
.
ORDERING INFORMATION
Device Package Shipping
MC100LVEL51DG SOIC8 NB
(Pb-Free)
98 Units/Tube
MC100LVEL51DR2G SOIC8 NB
(Pb-Free)
2500/Tape & Reel
TSSOP8
(Pb-Free)
MC100LVEL51DTR2G 2500/Tape & Reel
TSSOP8
(Pb-Free)
MC100LVEL51DTG 100 Units/Tube
DFN8
(Pb-Free)
MC100LVEL51MNR4G 1000/Tape & Reel
MC100LVEL51
www.onsemi.com
2
1
2
3
45
6
7
8
Q
V
EE
V
CC
D
Q
CLK
CLK
R
D
R
Flip-Flop
D
L
H
X
R
L
L
H
CLK
Z
Z
X
Q
L
H
L
Z = LOW to HIGH Transition
X = Don’t Care
CLK, CLK
ECL Differential Clock Input
Q, Q
ECL Differential Output
D ECL D Input
R ECL Reset Input
V
CC
Positive Supp;y
V
EE
Negative Supply
Table 1. PIN DESCRIPTION
PIN FUNCTION
Table 2. TRUTH TABLE
Figure 1. Logic Diagram and Pinout Assignment
EP (DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit. Elec-
trically connect to the most negative supply
(GND) or leave unconnected, floating open.
MC100LVEL51
www.onsemi.com
3
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
PECL Mode Power Supply V
EE
= 0 V 8 to 0 V
V
EE
NECL Mode Power Supply V
CC
= 0 V 8 to 0 V
V
I
PECL Mode Input Voltage
NECL Mode Input Voltage
V
EE
= 0 V
V
CC
= 0 V
V
I
V
CC
V
I
V
EE
6 to 0
6 to 0
V
I
out
Output Current Continuous
Surge
50
100
mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
SOIC8 NB 190
130
°C/W
q
JC
Thermal Resistance (Junction-to-Case) Standard Board SOIC8 NB 41 to 44 ± 5% °C/W
q
JA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
TSSOP8 185
140
°C/W
q
JC
Thermal Resistance (Junction-to-Case) Standard Board TSSOP8 41 to 44 ± 5% °C/W
q
JA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
DFN8 129
84
°C/W
T
sol
Wave Solder (Pb-Free) < 2 to 3 sec @ 260°C 265 °C
q
JC
Thermal Resistance (Junction-to-Case) (Note 1) DFN8 35 to 40 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. JEDEC standard multilayer board 2S2P (2 signal, 2 power)

MC100LVEL51DTR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Flip Flops 3.3V/5V ECL D-Type w/Diff Clock
Lifecycle:
New from this manufacturer.
Delivery:
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