Obsolete Product(s) - Obsolete Product(s)
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L6590
Figure 30. Test Board (2) Main Waveforms
Figure 31. Test Board (2) Load Transient Response
A1: Idrain
Ch1: Vdrain
Vin=100V
DC
Iout = 2 A
Vin = 400 V
DC
Iout = 2 A
A1: Idrain
Ch1: Vdrain
A1: Idrain
Ch1: Vdrain
Vin=100V
DC
Iout = 50 mA
A1: Idrain
Ch1: Vdrain
Vin = 400 V
DC
Iout = 50 mA
Vin=200V
DC
Iout = 0.1
0.3 A
Vout
Iout
transition
22
65 kHz
transition
65
22 kHz
Standby Function
is tripped
Vin = 200 V
DC
Iout = 0.2
0.4 A
Vout
Iout
Standby Function
is not tripped
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APPLICATION INFORMATION
In the following sections the functional blocks as well as the most important internal functions of the device will
be described.
Start-up Circuit
When power is first applied to the circuit and the voltage on the bulk capacitor is sufficiently high, an internal
high-voltage current generator is sufficiently biased to start operating and drawing about 4.5 mA through the
primary winding of the transformer and the drain pin. Most of this current charges the bypass capacitor connect-
ed between pin Vcc (3) and ground and makes its voltage rise linearly.
As the Vcc voltage reaches the start-up threshold (14.5V typ.) the chip, after resetting all its internal logic, starts
operating, the internal power MOSFET is enabled to switch and the internal high-voltage generator is discon-
nected. The IC is powered by the energy stored in the Vcc capacitor until the self-supply circuit (typically an
auxiliary winding of the transformer) develops a voltage high enough to sustain the operation.
As the IC is running, the supply voltage, typically generated by a self-supply winding, can range between 16 V
(Overvoltage protection limit, see the relevant section) and 7 V, threshold of the Undervoltage Lockout. Below
this value the device is switched off (and the internal start-up generator is activated). The two thresholds are in
tracking.
The voltage on the Vcc pin is limited at safe values by a clamp circuit. Its 17V threshold tracks the Overvoltage
protection threshold.
Figure 32. Start-up circuit internal schematic
Power MOSFET and Gate Driver
The power switch is implemented with a lateral N-channel MOSFET having a V
(BR)DSS
of 700V min. and a typ-
ical R
DS(on)
of 13
. It has a SenseFET structure to allow a virtually lossless current sensing (used only for pro-
tection).
During operation in Discontinuous Conduction Mode at low mains the drain voltage is likely to go below ground.
Any risk of injecting the substrate of the IC is prevented by an internal structure surrounding the switch.
The gate driver of the power MOSFET is designed to supply a controlled gate current during both turn-on and
turn-off in order to minimize common mode EMI.
Under UVLO conditions an internal pull-down circuit holds the gate low in order to ensure that the power MOS-
FET cannot be turned on accidentally.
17 V
DRAIN
Vcc
15 M
UVLO
150
GND
POWER
MOSFET
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L6590
Figure 33. PWM Control internal schematic
Oscillator and PWM Control
PWM regulation is accomplished by implementing voltage mode control. As shown in fig. 33, this block includes
an oscillator, a PWM comparator, a PWM latch and an Error Amplifier.
The oscillator operates at a frequency internally fixed at 65 kHz with a precision of ± 10 %. The maximum duty
cycle is limited at 70% typ.
The PWM latch (reset dominant) is set by the clock pulses of the oscillator and is reset by either the PWM com-
parator or the Overcurrent comparator.
The Error Amplifier (E/A) is an op-amp with a MOS input stage and a class AB output stage. The amplifier is
compensated for closed loop stability at unity gain, has a small-signal DC gain of 70 dB (typ.) and a gain-band-
width product over 1 MHz.
In case of overcurrent the error amplifier output saturates high and the conduction of the power MOSFET is
stopped by the OCP comparator instead of the PWM comparator.
Under zero load conditions the error amplifier is close to its low saturation and the gate drive delivers as short
pulses as it can, limited by internal delays. They are however too long to maintain the long-term energy balance,
thus from time to time some cycles need being skipped and the operation becomes asynchronous. This is au-
tomatically done by the control loop.
Standby Function
The standby function, optimized for flyback topology, automatically detects a light load condition for the convert-
er and decreases the oscillator frequency. The normal oscillation frequency is automatically resumed when the
output load builds up and exceeds a defined threshold.
This function allows to minimize power losses related to switching frequency, which represent the majority of losses
in a lightly loaded flyback, without giving up the advantages of a higher switching frequency at heavy load.
The Standby function is realized by monitoring the peak current in the power switch. If the load is low that it does
not reach a threshold (80 mA typ.), the oscillator frequency will be set at 22 kHz typ.
When the load demands more power and the peak primary current exceeds a second threshold (190 mA typ.)
the oscillator frequency is reset at 65 kHz. This 110 mA hysteresis prevents undesired frequency change when
power is such that the peak current is close to either threshold.
The signal coming from the sense circuit is digitally filtered to avoid false triggering of this function as a result of
large load changes or noise.
Clock
+
-
from OCP
comparator
COMP
S
R
Q
Max. Duty cycle
OSCILLATOR
+
-
to gate
driver
E/A
VFB
PWM

L6590D

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
AC/DC Converters 700 Volt Monolithic
Lifecycle:
New from this manufacturer.
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