4© 2013 Semtech Corporation
www.semtech.com
PROTECTION PRODUCTS
RClamp1821Z
Typical Characteristics
Typical Insertion Loss S21
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
retemaraPylbmessAnoitadnemmoceR
ngiseDlicnetSredloSdehsilop-ortcelE,tucresaL
epahserutrepA
dednuorhtiwralu
gnatceR
srenroc
ssenkcihTlicnetSredloS)"400.0(mm001.0
epyTetsaPredloSrellamsroerehpsezis4epyT
eliforPwolfeR
redloS020-DTS-JCEDEJreP
ngiseDdaPredloSBCPdenifedksamredloS-noN
hsiniFdaPBCPuAiNROPSO
Recommended Stencil Design
1 2
3
4
5
START
.
030 MHz
3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: - .22370 dB
800 MHz
2: - .22970 dB
900 MHz
3: - .28610 dB
1.8 GHz
4: - .52490 dB
2.5 GHz
5: - .45760 dB
2.7 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
-42 dB
-48 dB
Applications Information
0.300
0.370
0.088
Stencil Opening
Land Pad
All Dimensions are in mm.
Land Pad.
Stencil opening Component
