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DSC2311KI2-R0005T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
2016 Microchip Technology Inc. DS20005611A-page 7
DSC2311
4.0 CURRENT CONSUMPTION
Total Current = Disabled Current + ∆I
DD
F
OUT1
+ ∆I
DD
F
OUT2
FIGURE 4-1: ∆I
DD
/ Output vs. Frequency and Load @ 3.3V V
DD
3 pF
5 pF
10 pF
15 pF
F
OUT
(MHz)
ΔI
DD
(mA)
0 20 40 60 80 100 120 140
18
16
14
12
10
8
6
4
2
0
DSC2311
DS20005611A-page 8 2016 Microchip Technology Inc.
5.0 SOLDER REFLOW PROFILE
260°C
217°C
200°C
150°C
25°C
TEMPERATURE (°C)
8 MINUTES MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
PRE-HEAT
REFLOW
COOL
TIME
60-180
SECONDS
60-150
SECONDS
20-40
SECONDS
6°C/SEC. MAX.
6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.
Preheat Time 150°C to 200°C 60-180 sec.
Time Maintained above 217°C 60-150 sec.
Peak Temperature 255°C to 260°C
Time within 5°C of Actual Peak 20-40 sec.
Ramp-Down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 minutes max.
2016 Microchip Technology Inc. DS20005611A-page 9
DSC2311
6.0 PACKAGE MARKING INFORMATION
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
B
A
0.05
C
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
1
N
2X
TOP VIEW
SIDE VIEW
NOTE 1
0.10 C
0.08
C
Microchip Technology Drawing C04-1005A Sheet 1 of 2
2X
6X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
D
E
A
A1
0.10 C A B
0.05 C
BOTTOM VIEW
12
N
2X b2
4X b1
5X L1
L2
e
2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

DSC2311KI2-R0005T

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Description:
Standard Clock Oscillators Crystal-less Clock Gen.,-40-85C, 25ppm
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New from this manufacturer.
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