TCM809TVLB713 Datasheet TCM809RVLB713, TCM809ZENB713, TCM809JENB713 | P7-P9

 2001-2012 Microchip Technology Inc. DS21661E-page 7

TCM809/TCM810

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

3-Pin SOT-23B

XXNN

Legend: XX...X Customer-specific information*

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Example:

Customer Specific Information Codes for:

TCM8xx

Part Number TCM809

TCM810

TCM8xxLENB J1 K1

VNB JZ KZ

TCM8xxMENB J2 K2

VNB JY KY

TCM8xxTENB J3 K3

VNB JX KX

TCM8xxSENB J4 K4

VNB JV KV

TCM8xxRENB J5 K5

VNB JU KU

TCM8xxJ ENB J6 —

VNB JT KS

TCM8xxZENB J7 K6

3-Pin SC-70

Top Side

Bottom Side

XXN

YWW

XXNN

Example:

Customer Specific Information Codes for:

TCM8xx

Part Number TCM809

TCM810

TCM8xxL ELB J1 —

VLB JZ KZ

TCM8xxM ELB J2 —

VLB JY KY

TCM8xxT ELB J3 —

VLB JX KX

TCM8xxS ELB J4 —

VLB JV KV

TCM8xxR ELB J5 —

VLB JU KU

TCM8xxJ ELB J6 —

VLB JT KS

TCM8xxZ ELB J7 —

VLB JS KT

TCM809/TCM810

DS21661E-page 8  2001-2012 Microchip Technology Inc.

3-Lead Plastic Small Outline Transistor (NB) (SOT-23)

10501050



Mold Draft Angle Bottom

10501050



Mold Draft Angle Top

0.510.440.37.020.017.015BLead Width

0.180.140.09.007.006.004

Lead Thickness

10501050



Foot Angle

0.550.450.35.022.018.014LFoot Length

3.042.922.80.120.115.110DOverall Length

1.401.301.20.055.051.047E1Molded Package Width

2.642.372.10.104.093.083EOverall Width

0.100.060.01.004.002.000A1Standoff §

1.020.950.88.040.037.035A2Molded Package Thickness

1.121.010.89.044.040.035AOverall Height

1.92.076

Outside lead pitch (basic)

0.96

.038

Pitch

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units







* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-236

Drawing No. C04-104

§ Significant Characteristic

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

 2001-2012 Microchip Technology Inc. DS21661E-page 9

TCM809/TCM810

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

12°8°12°8°

Mold Draft Angle Bottom

12°8°12°8°

Mold Draft Angle Top

0.400.15.016.006BLead Width

0.250.08.010.003

Lead Thickness

0.410.10.016.004LFoot Length

2.251.80.089.071DOverall Length

1.351.15.053.045E1Molded Package Width

2.401.80.094.071EOverall Width

.0100.00.0004.000A1Standoff

1.000.80.039.031A2Molded Package Thickness

1.100.80.043.031AOverall Height

1.30 BSC.

Outside lead pitch (basic)

0.65 BSC.

Pitch

33Number of Pins

MAXMINMAXMINDimension Limits

MILLIMETERS*INCHESUnits

shall not exceed .005" (0.127mm) per side.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

Notes:

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

*Controlling Parameter

p1 D

.026 BSC.

.051 BSC.

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P16

TCM809TVLB713

Mfr. #:

Buy TCM809TVLB713

Manufacturer:

Microchip Technology

Description:

Supervisory Circuits Microprocessor 38V

Lifecycle:

New from this manufacturer.

Delivery:

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TCM809TVLB713

TCM809TVLB713

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