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NCV8774DT33RKG

P1-P3P4-P6P7-P9P10-P12
NCV8774
http://onsemi.com
10
DEFINITIONS
General
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Output voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
Line Regulation
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Quiescent and Disable Currents
Quiescent Current (I
q
) is the difference between the input
current (measured through the LDO input pin) and the
output load current.
Current Limit and Short Circuit Current Limit
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. Short Circuit
Current Limit is output current value measured with output
of the regulator shorted to ground.
PSRR
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
NCV8774
http://onsemi.com
11
APPLICATIONS INFORMATION
The NCV8774 regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
characteristics are shown in Figures 4 to 26.
Input Decoupling (C
in
)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV8774 package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
If extremely fast input voltage transients are expected then
appropriate input filter must be used in order to decrease
rising and/or falling edges below 50 V/ms for proper
operation. The filter can be composed of several capacitors
in parallel.
Output Decoupling (C
out
)
The NCV8774 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. Stability region of ESR vs Output Current
is shown in Figure 17. The minimum output decoupling
value is 1 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response.
Thermal Considerations
As power in the NCV8774 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8774 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8774 can handle is given by:
P
D
(
max
)
+
ƪ
T
J(max)
* T
A
ƫ
R
qJA
(eq. 1)
Since T
J
is not recommended to exceed 150°C, then the
NCV8774 soldered on 645 mm
2
, 1 oz copper area, FR4 can
dissipate up to 2.35 W when the ambient temperature (T
A
)
is 25°C. See Figure 27 for R
q
JA
versus PCB area. The power
dissipated by the NCV8774 can be calculated from the
following equations:
P
D
+ V
in
ǒ
I
q
@I
out
Ǔ
) I
out
ǒ
V
in
* V
out
Ǔ
(eq. 2)
or
V
in(max)
+
P
D(max)
)
ǒ
V
out
I
out
Ǔ
I
out
) I
q
(eq. 3)
NOTE: Items containing I
q
can be neglected if I
out
>> I
q
.
40
50
60
70
80
90
100
0 100 200 300 400 500 600 700
Figure 27. Thermal Resistance vs. PCB Copper Area
COPPER HEAT SPREADER (mm
2
)
R
q
JA
, THERMAL RESISTANCE (°C/W)
DPAK 1 oz
DPAK 2 oz
Hints
V
in
and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8774 and
make traces as short as possible.
ORDERING INFORMATION
Device Output Voltage Marking Package Shipping
†
NCV8774DT50RKG 5.0 V 877450G DPAK−3
(Pb−Free)
2500 /
Tape & Reel
NCV8774DT33RKG 3.3 V 877433G DPAK−3
(Pb−Free)
2500 /
Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCV8774
http://onsemi.com
12
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE D
b
D
E
b3
L3
L4
b2
e
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
A 0.086 0.094 2.18 2.38
b 0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c 0.018 0.024 0.46 0.61
e 0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L 0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒ
mm
inches
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H 0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2
GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCV8774/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
P1-P3P4-P6P7-P9P10-P12

NCV8774DT33RKG

Mfr. #:
Buy NCV8774DT33RKG
Manufacturer:
ON Semiconductor
Description:
LDO Voltage Regulators 3.3V / 350MA LDO
Lifecycle:
New from this manufacturer.
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