SENSOR DESCRIPTION
The CMV8000 is a global shutter CMOS image sensor with
3360 by 2496 pixels in a 4/3“ optical format. The image
array consists of 5.5 um by 5.5 um pipelined global
shutter pixels, which allow exposure during read out
while performing CDS operation reducing fixed pattern
and dark noise significantly. The CMV8000 has 16 digital
LVDS outputs (serial) each running at 600 Mbps, which
results in 104 fps frame rate at full resolution in 10-bit
mode. Higher frame rates can be achieved in row-
window-ing mode or row-subsampling mode. The image
sensor also integrates a programmable gain amplifier
and offset regulation. All operation modes are all pro-
grammable using a SPI interface. A programmable on-
board sequencer generates all internal exposure and read
out timings. External triggering and exposure pro-
gramming is also possible. Extended optical dynamic
range can be achieved by multiple integrated high
dynamic range modes. A 12-bit per pixel mode is avail-
able at reduced frame rates.
APPLICATION FIELDS
• Machine vision
• Motion control
• Traffic monitoring
• High speed inspection
• Security
CMV8000
8MP high speed global shutter image sensor
Please address all product inquiries and ordering information to:
CMOSIS · Coveliersstraat 15 · B-2600 Antwerpen · Phone: +32 3 260 17 33 · Fax: +32 3 260 17 79 · info@cmosis.com
Please visit our website for contact information on local distribution partners.
SENSOR FEATURES
• Pipelined global shutter with CDS
• 3360 (H) x 2496 (V) active pixels on a 5.5 µm pitch
• 2x 112 (left-right) optical black columns and
2x 16 (top-bottom) optical black rows
• Optical format of 4/3”
• 104 frames/s at full resolution in 10-bit mode
(40 fps in 12-bit mode)
• ROI windowing capability
(up to 8 separate ROIs - row based only)
• X-Y mirroring function
• 16 LVDS-outputs @ 600 Mbps multiplexable
to 8, 4 and 2 at reduced frame rate
• Multiple High Dynamic Range (HDR) modes up to 90 dB
• On chip temperature sensor
• On chip timing generation
• SPI-control
• 3.3V and 1.8V signaling
• Monochrome and Bayer (RGB) configuration
• Ceramic 107-pins µPGA package (30.5 mm x 26.5 mm)
• 2 sided AR-coated cover glass lid
