NCP439
www.onsemi.com
3
MAXIMUM RATINGS
Symbol Rating Value Unit
V
EN,
V
IN,
V
OUT
IN, OUT, EN, Pins −0.3 to + 4.0 V
V
IN,
V
OUT
From IN to OUT Pins: Input/Output 0 to + 4.0 V
ESD HBM Human Body Model (HBM) ESD Rating are (Notes 1 and 2) 2500 V
ESD MM Machine Model (MM) ESD Rating are (Notes 1 and 2) 250 V
ESD CDM Charge Device Model (CDM) ESD Rating are (Notes 1 and 2) 2000 V
LU Latch−up protection (Note 3)
− Pins IN, OUT, EN
100 mA
T
J
Maximum Junction Temperature −40 to + 125 °C
T
STG
Storage Temperature Range −40 to + 150 °C
MSL Moisture Sensitivity (Note 4) Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.5 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±250 V per JEDEC standard: JESD22−A115 for all pins.
Charge Device Model (CDM) ±2.0 kV per JEDEC standard: JESD22−C101 for all pins.
3. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 1.0 3.6 V
V
EN
Enable Voltage 0 3.6
T
A
Ambient Temperature Range −40 25 + 85 °C
C
IN
Decoupling input capacitor 0.1
mF
C
OUT
Decoupling output capacitor 0.1
mF
R
q
JA
Thermal Resistance Junction to Air WLCSP package (Note 5) 100 °C/W
I
OUT
Maximum DC current 2 A
P
D
Power Dissipation Rating (Note 6)
T
A
≤ 25°C WLCSP package 0.5
W
T
A
= 85°C WLCSP package 0.2
5. The R
q
JA
is dependent of the PCB heat dissipation and thermal via.
6. The maximum power dissipation (P
D
) is given by the following formula:
P
D
+
T
JMAX
* T
A
R
qJA
