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XC6210
Series
● SOT-89-5 Power Dissipation
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 1300
85 520
76.92
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
■PACKAGING INFORMATION (Continued)
Pd-Ta特性グラフ
0
200
400
600
800
1000
1200
1400
25 45 65 85 105 125
周辺温度Ta（℃）
許容損失Pd（mW）
Pd vs. Ta
Ambient Temperature Ta (℃)
Power Dissipation Pd (mW)
