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LAA108STR

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R04
LAA108
PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
4.0
4.5
5.0
5.5
6.0
6.5
On-Resistance vs. Temperature
(I
F
=2mA, I
L
=200mA)
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (mA)
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
Typical Load Current vs. Load Voltage
(I
F
=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
150
200
250
300
350
400
450
500
Maximum Load Current
vs. Temperature
(I
F
=5mA)
Single Pole Operating
Total Current - Both Poles Operating *
* Neither pole to exceed
single pole limits
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (V
P
)
134
136
138
140
142
144
146
148
150
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
5
10
15
20
25
Leakage Current vs. Temperature
Measured Across Pins 5 & 6, 7 & 8
(V
L
=100V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s
10s 100s
Load Curent (A)
Energy Rating Curve
(Single Pole, I
F
=5mA)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.2
I
NTEGRATED
C
IRCUITS
D
IVISION
LAA108
www.ixysic.com
5
R04
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA108 / LAA108S / LAA108P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA108 / LAA108S 250ºC for 30 seconds
LAA108P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R04
LAA108
MECHANICAL DIMENSIONS
LAA108
LAA108S
LAA108P
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
P1-P3P4-P6P7-P7

LAA108STR

Mfr. #:
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Manufacturer:
Description:
Solid State Relays - PCB Mount Dual Single Pole 100V 300mA Relay
Lifecycle:
New from this manufacturer.
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