Philips Semiconductors Product specification
74F244/74F244BOctal buffers (3-State)
1994 Dec 5
5
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
TEST
LIMITS
CONDITIONS
1
MIN TYP
2
MAX
V
CC
= MIN, I
OH
= -3mA
±10%V
CC
2.5 V
V
OH
High-level output voltage
V
IL
= MAX,
±5%V
CC
2.7 3.4 V
V
IH
= MIN I
OH
= -15mA
±10%V
CC
2.0 V
±5%V
CC
2.0 V
V
OL
Low-level output voltage
V
CC
= MIN,
V
IL
= MAX,
I
OL
= MAX ±10%V
CC
0.55 V
V
IH
= MIN, ±5%V
CC
0.42 0.55 V
V
IK
Input clamp voltage V
CC
= MIN, I
I
= I
IK
-0.73 -1.2 V
I
I
Input current at maximum input voltage V
CC
= MAX, V
I
= 7.0V 100 µA
I
IH
High-level input current V
CC
= MAX, V
I
= 2.7V 20 µA
74F244 OEa, OEb -1.0 mA
I
IL
Low-level input current 74F244 Ian, Ibn V
CC
= MAX, V
I
= 0.5V -1.6 mA
74F244B all inputs -40 µA
I
OZH
Off-state output current,
high-level voltage applied
V
CC
= MAX, V
O
= 2.7V 50
µA
I
OZL
Off-state output current,
low-level voltage applied
V
CC
= MAX, V
O
= 0.5V -50
µA
I
OS
Short-circuit output current
V
CC
= MAX -100 -225 mA
I
CCH
40 60 mA
74F244 I
CCL
V
CC
= MAX 60 90 mA
I
CC
Supply current (total) I
CCZ
60 90 mA
I
CCH
20 30 mA
74F244B I
CCL
V
CC
= MAX 50 70 mA
I
CCZ
29 40 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25°C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
