74AHC_AHCT2G125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 6 May 2013 9 of 16
NXP Semiconductors
74AHC2G125; 74AHCT2G125
Dual buffer/line driver; 3-state
Test data is given in Table 10.
Definitions test circuit:
R
T
= Termination resistance should be equal to output impedance Z
o
of the pulse generator.
C
L
= Load capacitance including jig and probe capacitance.
R
L
= Load resistance.
S1 = Test selection switch.
Fig 8. Test circuit for measuring switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aad983
DUT
V
CC
V
CC
V
I
V
O
R
T
R
L
S1
C
L
open
G
Table 10. Test data
Type Input Load S1 position
V
I
t
r
, t
f
C
L
R
L
t
PHL
, t
PLH
t
PZH
, t
PHZ
t
PZL
, t
PLZ
74AHC2G125 V
CC
3 ns 15 pF, 50 pF 1 k open GND V
CC
74AHCT2G125 3 V 3 ns 15 pF, 50 pF 1 k open GND V
CC
74AHC_AHCT2G125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 6 May 2013 10 of 16
NXP Semiconductors
74AHC2G125; 74AHCT2G125
Dual buffer/line driver; 3-state
13. Package outline
Fig 9. Package outline SOT505-2 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(1)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.70
0.35
8°
0°
0.13 0.10.20.5
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.47
0.33
SOT505-2 - - -
02-01-16
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
2
A
1
L
p
(A
3
)
detail X
A
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
1.1
pin 1 index
74AHC_AHCT2G125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 6 May 2013 11 of 16
NXP Semiconductors
74AHC2G125; 74AHCT2G125
Dual buffer/line driver; 3-state
Fig 10. Package outline SOT765-1 (VSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.1
8°
0°
0.13 0.10.20.4
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.40
0.15
Q
0.21
0.19
SOT765-1 MO-187
02-06-07
w M
b
p
D
Z
e
0.12
14
8
5
θ
A
2
A
1
Q
L
p
(A
3
)
detail X
A
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
1
pin 1 index

74AHCT2G125GD,125

Mfr. #:
Manufacturer:
Nexperia
Description:
Buffers & Line Drivers CMOS 2CH NON-INVERT
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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