ADG1308/ADG1309
Rev. A | Page 13 of 16
TERMINOLOGY
R
ON
Ohmic resistance between D and S.
ΔR
ON
Difference between the R
ON
of any two channels.
I
S
(Off)
Source leakage current when the switch is off.
I
D
(Off)
Drain leakage current when the switch is off.
I
D
, I
S
(On)
Channel leakage current when the switch is on.
V
D
(V
S
)
Analog voltage on Terminal D and Terminal S.
C
S
(Off)
Channel input capacitance for off condition.
C
D
(Off)
Channel output capacitance for off condition.
C
D
, C
S
(On)
On switch capacitance.
C
IN
Digital input capacitance.
t
ON
(EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition.
t
OFF
(EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
t
TRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
T
BBM
Off time measured between the 80% point of both switches
when switching from one address state to another.
V
INL
Maximum input voltage for Logic 0.
V
INH
Minimum input voltage for Logic 1.
I
INL
(I
INH
)
Input current of the digital input.
I
DD
Positive supply current.
I
SS
Negative supply current.
Off Isolation
A measure of unwanted signal coupling through an off channel.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
ADG1308/ADG1309
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 23. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AC
10.00 (0.3937)
9.80 (0.3858)
16
9
8
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
060606-A
45°
Figure 24. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1308BRUZ
1
−40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1308BRUZ-REEL7
1
−40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1308BRZ
1
−40°C to +105°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1308BRZ-REEL7
1
−40°C to +105°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1309BRUZ
1
−40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1309BRUZ-REEL7
1
−40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1309BRZ
1
−40°C to +105°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG1309BRZ-REEL7
1
−40°C to +105°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
1
Z = RoHS Compliant Part.
ADG1308/ADG1309
Rev. A | Page 15 of 16
NOTES

ADG1309BRUZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 4-CH +-15V/+12V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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