SI1065X-T1-E3

Vishay Siliconix
Si1065X
Document Number: 74320
S12-1619-Rev. D, 09-Jul-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
P-Channel 12 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET
100 % R
g
Te s t e d
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Load Switch for Portable Devices
Notes:
a. Maximum under steady state conditions is 650 °C/W.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A) Q
g
(Typ.)
- 12
0.156 at V
GS
= - 4.5 V
1.18
6.7 nC
0.190 at V
GS
= - 2.5V
1.07
0.245 at V
GS
= - 1.8V
0.49
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 12
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
A
= 25 °C
I
D
- 1.18
b, c
A
T
A
= 70 °C
- 0.94
b, c
Pulsed Drain Current
I
DM
- 8
Continuous Source-Drain Diode Current
T
A
= 25 °C I
S
- 0.2
b, c
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
0.236
b, c
W
T
A
= 70 °C
0.151
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, b
t 5 s
R
thJA
440 530
°C/W
Steady State
State
540 650
Ordering Information: Si1065X-T1-GE3 (Lead (Pb)-free and Halogen-free)
Marking Code
W XX
Lot Traceability
and Date Code
Part # Code
Y
Y
SC-89 (3-LEADS)
6
4
1
2
3
5
Top View
D
D
G
D
D
S
P-Channel MOSFET
D
S
G
www.vishay.com
2
Document Number: 74320
S12-1619-Rev. D, 09-Jul-12
Vishay Siliconix
Si1065X
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 12 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= - 250 µA
- 8.47
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
2.33
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.45 - 0.95 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 12 V, V
GS
= 0 V
- 1 nA
V
DS
= - 12 V, V
GS
= 0 V, T
J
= 85 °C
- 10 µA
On-State Drain Current
a
I
D(on)
V
DS
= 5 V, V
GS
= - 4.5 V
- 8 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 1.18 A
0.108 0.156
V
GS
= - 2.5 V, I
D
= - 1.07 A
0.131 0.190
V
GS
= - 1.8 V, I
D
= - 0.49 A
0.158 0.245
Forward Transconductance
g
fs
V
DS
= - 6 V, I
D
= - 1.18 A
5.18 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 6 V, V
GS
= 0 V, f = 1 MHz
480
pFOutput Capacitance
C
oss
190
Reverse Transfer Capacitance
C
rss
145
Total Gate Charge
Q
g
V
DS
= - 6 V, V
GS
= - 5 V, I
D
= - 1.18 A
7.2 10.8
nC
V
DS
= - 6 V, V
GS
= - 4.5 V, I
D
= - 1.18
6.7 10.1
Gate-Source Charge
Q
gs
0.84
Gate-Drain Charge
Q
gd
2.7
Gate Resistance
R
g
f = 1 MHz 10 15
Turn- On D elay Tim e
t
d(on)
V
DD
= - 6 V, R
L
= 6.32
I
D
- 0.95 A, V
GEN
= - 4.5 V, R
g
= 1
13 19.5
ns
Rise Time
t
r
27 40.5
Turn-Off DelayTime
t
d(off)
45 67.5
Fall Time
t
f
27 40.5
Drain-Source Body Diode Characteristics
Pulse Diode Forward Current
a
I
SM
8A
Body Diode Voltage
V
SD
I
S
= - 0.63 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 0.7 A, dI/dt = 100 A/µs
29.2 44 nC
Body Diode Reverse Recovery Charge
Q
rr
10.22 15.3
nsReverse Recovery Fall Time
t
a
13.7
Reverse Recovery Rise Time
t
b
15.5
Document Number: 74320
S12-1619-Rev. D, 09-Jul-12
www.vishay.com
3
Vishay Siliconix
Si1065X
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
2
4
6
8
0.0 0.6 1.2 1.8 2.4 3.0
V
GS
= 5 V thru 2.5 V
V
DS
- Drain-to-Source Voltage (V)
)A( tnerruC niarD -I
D
V
GS
= 1.5 V
V
GS
= 1.0 V
V
GS
= 2 V
0.00
0.05
0.10
0.15
0.20
0.25
0246
8
e (Ω)cnatsiseR-nO -R
DS(on)
I
D
- Drain Current (A)
V
GS
= 2.5 V
V
GS
= 1.8 V
V
GS
= 4.5 V
0
1
2
3
4
5
02468
I
D
= 1.18 A
)V
(
e
ga
tl
oV
ec
ru
oS
-o
t-e
ta
G
-
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 6 V
V
DS
= 9.6 V
Transfer Characteristics Curves vs. Temp.
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.5
1.0
1.5
2.0
0.0 0.5 1.0 1.5 2.0
T
C
= 125 °C
V
GS
- Gate-to-Source Voltage (V)
)A( tnerruC niarD -I
D
T
C
= 25 °C
T
C
= - 55 °C
0
200
400
600
800
1000
036912
C
rss
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
)Fp( ec
na
t
i
c
apaC
-
C
0.8
0.9
1.0
1.1
1.2
1.3
1
.
4
- 50 - 25 0 25 50 75 100 125 150
ecn
a
tsi
s
eR
-
nO
-
R
)no(SD
GS
- Gate-to-Source Voltage (V)
V
V
GS
= 4.5 V, I
D
= 1.18 A
V
GS
= 1.8 V, I
D
= 0.94 A
V
GS
= 2.5 V, I
D
= 1.07 A
(Normalized)

SI1065X-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 12V 1.18A 0.236W 130 mohms @ 4.5V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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