NXP Semiconductors
AN11293
BGA3012 - 5 MHz to 300 MHz 12 dB reverse amplifier application
AN11293
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Application note
Rev. 114 February 2013
4 of 19
4. Application Information
For evaluation purposes an evaluation board is available. The evaluation circuit can be
seen in figure 1 and the corresponding PCB is shown in figure 2. Table 1 shows the bill
of materials.
4.1 Evaluation board circuit
Fig 1. BGA3012 evaluation circuit
The power supply is applied on the center pin of connector J3 and is applied to the MMIC
via choke L2 which provides RF blocking to the supply line. Capacitors C4 and C5 are
supply decoupling capacitors.
At the F-connector J1 the RF input signal is applied where capacitor C1 provides DC-
blocking. Resistors R1 and R2 are used as feedback resistors to set the gain and slope.
Two resistors are used to lower the influence of the parasitic capacitance from the circuit
board. Capacitor C2 provides DC-blocking between the input and output of the MMIC.
Capacitor C3 provides DC-blocking before the RF signal is available at F-connector J2.
NXP Semiconductors
AN11293
BGA3012 - 5 MHz to 300 MHz 12 dB reverse amplifier application
AN11293
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Application note
Rev. 114 February 2013
5 of 19
4.2 Evaluation board layout
Fig 2. BGA3012 evaluation board layout
For optimum distortion performance it is important to have enough ground vias
underneath and around the MMICs ground pins. This lowers the inductance to the
ground plane.
The evaluation board is made with two layer FR4 material.
PCB material = FR4
PCB thickness = 1.5 mm
PCB size = 40 mm x 40 mm
ε
r
= 4.6
Copper thickness = 35 µm
NXP Semiconductors
AN11293
BGA3012 - 5 MHz to 300 MHz 12 dB reverse amplifier application
AN11293
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Application note
Rev. 114 February 2013
6 of 19
4.3 Bill of materials
Table 1. Evaluation board BoM
Circuit
Reference
Description
Qty
Mfr
Manufacturer number
Supplier
Supplier part
number
U1
BGA3012
1
NXP
BGA3012
NXP
BGA3012
C1, C2,
C3, C4
10 nF 4 Murata GRM155R71E103KA01D Digikey 490-1312-1-ND
C5 100 pF 1 Murata GRM1555C1H101JZ01D Digikey 490-3458-1-ND
L2 22uH 1 Murata LQH31CN220K03L Digikey LQH31CN220K03L-
ND
R1
300
1
Yageo
RC0402FR-07300RL
Digikey
311-300LRCT-ND
R2
100
1
Yageo
RC0402FR-07100RL
Digikey
311-100LRCT-ND
J1, J2 75 Ω F-
connector
2 Bomar 861V509ER6 Mouser 678-861V509ER6
J3 Header 3 1 Molex 90121-0763 Digikey WM8109-ND

OM7862/BGA3012/RAMP,598

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
BOARD OM7862 BGA3012
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet