Vishay Siliconix
SiR872ADP
Document Number: 63979
S12-3079-Rev. A, 24-Dec-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 150 V (D-S) MOSFET
FEATURES
• TrenchFET
®
Power MOSFET
• 100 % R
g
and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Fixed Telecom
• DC/DC Converter
• Primary and Secondary Side Switch
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 54 °C/W.
g. T
C
= 25 °C.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
() Max.
I
D
(A)
g
Q
g
(Typ.)
150
0.0180 at V
GS
= 10 V
53.7
22.8 nC
0.0230 at V
GS
= 7.5 V
45
Ordering Information:
SiR872ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK
®
SO-8
Bottom View
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
150
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
53.7
A
T
C
= 70 °C
43
T
A
= 25 °C
12.8
b, c
T
A
= 70 °C
10.2
b, c
Pulsed Drain Current (t = 300 µs)
I
DM
100
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
60
a
T
A
= 25 °C
5.6
b, c
Single Pulse Avalanche Current
L =0.1 mH
I
AS
30
Single Pulse Avalanche Energy
E
AS
45 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
104
W
T
C
= 70 °C
66.6
T
A
= 25 °C
6.25
b, c
T
A
= 70 °C
4
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
R
thJA
15 20
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
0.9 1.2