VS-HFA06TB120STRRP

VS-HFA06TB120SPbF
www.vishay.com
Vishay Semiconductors
Revision: 26-Feb-16
1
Document Number: 94039
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
HEXFRED
®
Ultrafast Soft Recovery Diode, 6 A
FEATURES
Ultrafast and ultrasoft recovery
Very low I
RRM
and Q
rr
Specified at operating conditions
Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
BENEFITS
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION
VS-HFA06TB120S is a state of the art ultrafast recovery
diode. Employing the latest in epitaxial construction and
advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 1200 V and 6 A continuous current, the
VS-HFA06TB120S is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED
®
product line features
extremely low values of peak recovery current (I
RRM
) and
does not exhibit any tendency to “snap-off” during the
t
b
portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED VS-HFA06TB120S is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRODUCT SUMMARY
Package TO-263AB (D
2
PAK)
I
F(AV)
6 A
V
R
1200 V
V
F
at I
F
2.4 V
t
rr
(typ.) 26 ns
T
J
max. 150 °C
Diode variation Single die
TO-263AB (D
2
PAK)
Anode
1
3
2
N/C
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
R
1200 V
Maximum continuous forward current I
F
T
C
= 100 °C 6
ASingle pulse forward current I
FSM
80
Maximum repetitive forward current I
FRM
24
Maximum power dissipation P
D
T
C
= 25 °C 62.5
W
T
C
= 100 °C 25
Operating junction and storage temperature range T
J
, T
Stg
-55 to +150 °C
VS-HFA06TB120SPbF
www.vishay.com
Vishay Semiconductors
Revision: 26-Feb-16
2
Document Number: 94039
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ELECTRICAL SPECIFICATIONS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
V
BR
I
R
= 100 μA 1200 - -
V
Maximum forward voltage V
FM
I
F
= 6.0 A - 2.7 3.0
I
F
= 12 A - 3.5 3.9
I
F
= 6.0 A, T
J
= 125 °C - 2.4 2.8
Maximum reverse
leakage current
I
RM
V
R
= V
R
rated - 0.26 5.0
μA
T
J
= 125 °C, V
R
= 0.8 x V
R
rated - 110 500
Junction capacitance C
T
V
R
= 200 V - 9.0 14 pF
Series inductance L
S
Measured lead to lead 5 mm from package body - 8.0 - nH
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/μs, V
R
= 30 V - 26 -
nst
rr1
T
J
= 25 °C
I
F
= 6.0 A
dI
F
/dt = 200 A/μs
V
R
= 200 V
-5380
t
rr2
T
J
= 125 °C - 87 130
Peak recovery current
I
RRM1
T
J
= 25 °C - 4.4 8.0
A
I
RRM2
T
J
= 125 °C - 5.0 9.0
Reverse recovery charge
Q
rr1
T
J
= 25 °C - 116 320
nC
Q
rr2
T
J
= 125 °C - 233 585
Peak rate of recovery current
during t
b
dI
(rec)M
/dt1 T
J
= 25 °C - 180 -
A/μs
dI
(rec)M
/dt2 T
J
= 125 °C - 100 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
lead
0.063" from case (1.6 mm) for 10 s - - 300 °C
Thermal resistance,
junction to case
R
thJC
--2.0
K/W
Thermal resistance,
junction to ambient
R
thJA
Typical socket mount - - 80
Thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased - 0.5 -
Weight
-2.0- g
-0.07- oz.
Marking device Case style TO-263AB (D
2
PAK) HFA06TB120S
VS-HFA06TB120SPbF
www.vishay.com
Vishay Semiconductors
Revision: 26-Feb-16
3
Document Number: 94039
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Typical Forward Voltage Drop Characteristics Fig. 2 - Typical Reverse Current vs. Reverse Voltage
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Thermal Impedance Z
thJC
Characteristics
T
J
= 150 °C
T
J
= 125 °C
T
J
= 25 °C
I
F
- Instantaneous Forward Current (A)
V
FM
- Forward Voltage Drop (V)
0123456
0.1
1
100
10
94039_01
I
R
- Reverse Current (μA)
V
R
- Reverse Voltage (V)
0 200 400 600 1000 1200800 1400
0.01
0.1
1
10
100
1000
94039_02
T
J
= 25 °C
T
J
= 125 °C
T
J
= 100 °C
T
J
= 150 °C
C
T
- Junction Capacitance (pF)
V
R
- Reverse Voltage (V)
1 10 100 1000 10 000
1
10
100
94039_03
T
J
= 25 °C
Single pulse
(thermal resistance)
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10
t
1
- Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance (°C/W)
100
94039_04
P
DM
t
2
t
1
Notes:
1. Duty factor D = t
1
/t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C

VS-HFA06TB120STRRP

Mfr. #:
Manufacturer:
Vishay Semiconductors
Description:
Rectifiers RECOMMENDED ALT 78-VS-HFA06TB120SRM3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet