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RT8063GSP

P1-P3P4-P6P7-P9P10-P11
RT8063
10
DS8063-07 November 2012www.richtek.com
©
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Figure 3. Derating Curve of Maximum Power Dissipation
Layout Considerations
Follow the PCB layout guidelines for optimal performance
of the IC.
` Connect the terminal of the input capacitor(s), C
IN
, as
close as possible to the VIN pin. This capacitor provides
the AC current into the internal power MOSFETs.
` LX node experiences high frequency voltage swing and
should be kept within a small area.
` Keep all sensitive small-signal nodes away from the LX
node to prevent stray capacitive noise pick up.
` Connect the FB pin directly to the feedback resistors.
The resistive voltage divider must be connected between
V
OUT
and GND.
Figure 4. PCB Layout Guide
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0 25 50 75 100 125
Ambient Temperature (
°
C)
Maximum Power Dissipation (W) 1
Four-Layer PCB
COMP
GND
EN
VIN
FB
RT
LX
LX
GND
2
3
4
5
6
7
8
9
Place the compensation
components as close to
the IC as possible
V
OUT
GND
R2
R1
V
IN
C
IN
C
OUT
V
OUT
L1
R
COMP
C
COMP
LX should be connected
to inductor by wide and
short trace, and keep
sensitive components
away from this trace
Place the feedback
resistors as close to the
IC as possible
Place the input and output capacitors
as close to the IC as possible
GND
R
OSC
The maximum power dissipation depends on the operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance, θ
JA
. The derating curve in Figure 3 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
RT8063
11
DS8063-07 November 2012 www.richtek.com
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Outline Dimension
A
B
J
F
H
M
C
D
I
Y
X
EXPOSED THERMAL PAD
(Bottom of Package)
8-Lead SOP (Exposed Pad) Plastic Package
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138
P1-P3P4-P6P7-P9P10-P11

RT8063GSP

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IC REG BUCK ADJUSTABLE 3A 8SOP
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