PDF: 09005aef8137b07b/Source: 09005aef8137b02d Micron Technology, Inc., reserves the right to change products or specifications without notice.
SD8_16C16_32x64AG.fm - Rev. E 12/10 EN
23 ©2003, 2004 Micron Technology, Inc. All rights reserved.
1. The value of
t
RAS used for the -13E module is calculated from
t
RC -
t
RP. Actual device spec. vaule is 37ns.
33
Command Address Hold,
t
AH
0.8 (-13E/-133)
1 (-10E)
08
10
08
10
34
Data Signal Input Setup,
t
DS
1.5 (-13E/-133)
2 (-10E)
15
20
15
20
35
Data Signal Input Hold,
t
DH
0.8 (-13E/-133)
1 (-10E)
08
10
08
10
36–40
Reserved Bytes
00 00
41
Device Minimum Active/Auto-Refresh Time,
t
RC
60ns (-13E)
66ns (-133)
70ns (-10E)
3C
42
46
3C
42
46
42–61
Reserved Bytes
00 00
62
SPD Revision
REV.2.0 02 12
63
Checksum For Bytes 0-62
(-13E)
(-133)
(-10E)
94
E0
2C
95
E1
2D
64
Manufacturer's JEDEC ID Code
MICRON 2C 2C
65-71
Manufacturer's JEDEC Code (Cont.)
FF FF
72
Manufacturing Location
00–12 00–0C 00–0C
73–90
Module Part Number (ASCII)
Variable Data Variable Data
91
PCB Identification Code
Variable Data Variable Data
92
Identification Code (Continuted)
00000
93
Year of Manufacture in BCD
Variable Data Variable Data
94
Week of Manufacture in BCD
Variable Data Variable Data
95–98
Module Serial Number
Variable Data Variable Data
99–125
Manufacturer-Specific Data (RSVD)
126
System Frequency
100 MHz
(-13E/-133, -10E)
64 64
127
Year of Manufacture in BCD
AF FF
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”
