IXTA2N80

Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 800 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 M 800 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
C
= 25°C2A
I
DM
T
C
= 25°C, pulse width limited by T
JM
8A
I
AR
2 A
E
AR
T
C
= 25°C6mJ
E
AS
T
C
= 25°C 200 mJ
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
, 5 V/ns
T
J
150°C, R
G
= 18
P
D
T
C
= 25°C54W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
M
d
Mounting torque 1.13/10 Nm/lb.in.
Weight 4 g
Maximum lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s
High Voltage MOSFET
N-Channel Enhancement Mode
Avalanche Energy Rated
G = Gate, D = Drain,
S = Source, TAB = Drain
D (TAB)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 250 µA 800 V
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 2.5 5.5 V
I
GSS
V
GS
= ±20 V
DC
, V
DS
= 0 ±100 nA
I
DSS
V
DS
= V
DSS
25 µA
V
GS
= 0 V T
J
= 125°C 500 µA
R
DS(on)
V
GS
= 10 V, I
D
= 0.5 I
D25
6.2
Pulse test, t 300 µs, duty cycle d 2 %
Features
y International standard packages
y Low R
DS (on)
HDMOS
TM
process
y Rugged polysilicon gate cell structure
y Low package inductance (< 5 nH)
- easy to drive and to protect
y Fast switching times
Applications
y Switch-mode and resonant-mode
power supplies
y Flyback inverters
y DC choppers
Advantages
y Space savings
y High power density
98541B(01/03)
G
D
S
TO-220AB (IXTP)
© 2003 IXYS All rights reserved
G
S
TO-263 AA (IXTA)
D (TAB)
V
DSS
= 800 V
I
D25
= 2 A
R
DS(on)
= 6.2
IXTA 2N80
IXTP 2N80
Preliminary Data
IXYS reserves the right to change limits, test conditions, and dimensions.
IXTA 2N80
IXTP 2N80
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
g
fs
V
DS
= 20 V; I
D
= 0.5 • I
D25
, pulse test 1.0 2.0 S
C
iss
440 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 56 pF
C
rss
15 pF
t
d(on)
15 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 I
D25
18 ns
t
d(off)
R
G
= 18Ω, (External) 30 ns
t
f
15 ns
Q
g(on)
22 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 I
D25
5.5 nC
Q
gd
12 nC
R
thJC
2.3 K/W
R
thCK
(IXTP) 0.5 K/W
Source-Drain Diode Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
V
GS
= 0 V 2 A
I
SM
Repetitive; pulse width limited by T
JM
8A
V
SD
I
F
= I
S
, V
GS
= 0 V, 1.8 V
Pulse test, t 300 µs, duty cycle d 2 %
t
rr
I
F
= I
S
, -di/dt = 100 A/µs, V
R
= 100 V 510 ns
Pins: 1 - Gate 2 - Drain
3 - Source 4 - Drain
Bottom Side
TO-220 AD Dimensions
TO-263 AA Outline
1. Gate
2. Drain
3. Source
4. Drain
Bottom Side
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.06 4.83 .160 .190
A1 2.03 2.79 .080 .110
b 0.51 0.99 .020 .039
b2 1.14 1.40 .045 .055
c 0.46 0.74 .018 .029
c2 1.14 1.40 .045 .055
D 8.64 9.65 .340 .380
D1 7.11 8.13 .280 .320
E 9.65 10.29 .380 .405
E1 6.86 8.13 .270 .320
e 2.54 BSC .100 BSC
L 14.61 15.88 .575 .625
L1 2.29 2.79 .090 .110
L2 1.02 1.40 .040 .055
L3 1.27 1.78 .050 .070
L4 0 0.38 0 .015
R 0.46 0.74 .018 .029

IXTA2N80

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 800V 2A TO-263
Lifecycle:
New from this manufacturer.
Delivery:
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