MX868RTR Datasheet MX868R, MX868RTR | P7-P9

MX868

IXYS

Application Example

This application example illustrates one method of incorporating the MX868 into a power circuit board

design. The double-sided 8oz copper traces carry 50A (25 A on the top trace and 25A on the bottom

trace) around the center section of the planar E-core. The MX868 is mounted on a small single layer flex

circuit that effectively adds a third layer. The flex also fans out the fine pitch DFN package to a pitch

compatible with the power board. The magnetic circuit consists of two ferrite E14 planar cores. The

center post of one of the cores is gapped to accommodate the MX868 package thickness plus the flex

circuit thickness. For the 50A full scale application a gap of 47 to 52 mils is appropriate (1.2 to 1.32 mm).

The gain trim range of the MX868 can accommodate even larger gaps if required.

Flex circuit MX868

(2) E14 planar cores

Cross Section (drawing not to scale)

PCB top layer: (scale 1X) PCB bottom layer: (top view, 1X) Flex circuit: (component side, 1X)

This following example illustrates the MX868 mounted directly on a 1oz PCB with a copper strap

positioned around the Hall element to carry the current being measured.

MX868

Copper stamping, thickness as required

Design alternatives:

The use of an E-I core pair results in a lower profile than E-E however a thinner board must be used. A

thinner sensor can be obtained by FCOF (flip chip on flex) packaging of the MX868 bumped die. The

maximum mounting height of the DFN package is 1.1 mm whereas the chip height is about 0.4 mm.

MX868 7 03/03/08

Drawing No. 086809 www.claremicronix.com

MX868 8 03/03/08

MX868

IXYS

8 Lead DFN

IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this

publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither

circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,

IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products

including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any

intellectual property right.

Drawing No. 086809 www.claremicronix.com

World Wide Sales Offices

MX868 9 03/03/08

IXYS

IXYS Corporation

3540 Bassett Street

Santa Clara, CA 925054

Tel: 1-408-982-0700

Fax: 1-408-496-0670

e-mail:sales@ixys.net

Micronix

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SALES OFFICES AMERICAS

Eastern Region

[Eastern North America, Mexico, South America]

IXYS Corporation

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Central Region

[Central North America]

IXYS Corporation

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Tel: 724-836-8530

Fax: 724-836-8540

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Western Region

[Western North America]

IXYS Coporation

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Tel: 858-792-1101

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SALES OFFICES EUROPE

European Headquarters

IXYS Semiconductor GMBH

Edisonstrasse 15

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Fax: 49-6206-503286

marcom@ixys.de

United Kingdom

IXYS Semiconductor Limited

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sales@ixys.co.uk

Sales Offices ASIA / PACIFIC

Asian Headquarters

IXYS

Room 1016, Chia-Hsin, Bldg II,

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Fax: 886-2-2523-6368

bradley.green@ixys.co.uk

Jhong@clare.com

Check the IXYS Website for the local sales

office nearest you. (www.ixys.com)

http://www.claremicronix.com

IXYS cannot assume responsibility for use of any circuitry other than circuitry

entirely embodied in this IXYS product. No circuit patent licenses nor indemnity

are expressed or implied. IXYS reserves the right to change the specification and

circuitry, without notice at any time. The products described in this document are

not intended for use in medical implantation or other direct life support

applications where malfunction may result in direct physical harm, injury or death

to a person.

Specification: MX868

Drawing No. 086809 www.claremicronix.com

P1-P3 P4-P6 P7-P9

MX868RTR

Mfr. #:

Buy MX868RTR

Manufacturer:

Description:

SENSOR HALL EFFECT SPI 8DFN

Lifecycle:

New from this manufacturer.

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MX868RTR

MX868RTR

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