SOD−123
CASE 425−04
ISSUE G
DATE 07 OCT 2009
SCALE 5:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
b
D
A
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A 0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b 0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D 1.40 1.80
E 2.54 2.69 2.84 0.100
---
3.68 0.140
L 0.25
3.86
0.010
H
E
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
H
E
---
--- ---
0.006
--- ---
--- ---
GENERIC
MARKING DIAGRAM*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
*This information is generic. Please refer to device
data sheet for actual part marking. Pb−Free indicator,
“G” or microdot “ G”, may or may not be present.
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
XXXMG
G
1
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.22
0.048
0.91
0.036
2.36
0.093
4.19
0.165
ǒ
mm
inches
Ǔ
SCALE 10:1
q
--- ---
q 00
10 10
°°° °
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASB42927B
ON SEMICONDUCTOR STANDARD
SOD−123
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
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