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2. Functional Description
IX9915 is the functional equivalent of a 4-terminal 431
type precision shunt regulator and a high voltage
Darlington transistor in the same package.
The typical application for IX9915 is shown in
Figure 5.
Figure 5 IX9915 Application Diagram
This is a simplified application circuit that shows how
the IX9915 can be used in an LED lamp control circuit.
The high voltage Darlington transistor will bleed the
current when V
LINE
is lower than the predetermined
voltage. The 4-terminal 431 type shunt regulator is
used to monitor V
LINE
voltage and control the
Darlington transistor bleeding the current (ON) or not
(OFF). When V
LINE
reaches the predetermined
voltage, the shunt regulator starts to regulate to drive
V
OC
going low, and turns off the Darlington transistor
to make sure this bleeder circuitry only burns a little
power at the higher V
LINE
voltage. Maximum bleeding
current I
H
can be controlled by properly choosing R
E
and V
REG
.
Regulation of V
REG
is made possible by applying a
scaled sample of its voltage to pin FB, the error
amplifier's non-inverting input. The error amplifier
compares this scaled voltage against an internal high
accuracy reference voltage and generates an output
current which in turn regulate V
REG
through the
resistor R
3
.
As V
REG
increases, the error amplifier's input voltage
V
FB
will also increase. Ramping of V
FB
beyond the
internal reference voltage causes the error amplifier to
sink more I
OC
, which in turn decreases V
REG
.
Likewise, a reduction of V
REG
results in a lessoning of
I
OC
causing V
REG
to increase.
2.1 Regulation Voltage
When connected as shown in the application circuit
above and properly configured, the IX9915 will
regulate V
REG
such that V
FB
is equal to V
REF
(1.299V).
To achieve this, the values of the voltage divider
resistors, R
1
and R
2
, must be set in the following
manner:
Because V
REG
regulation occurs when V
FB
=V
REF
any
change in bias current through R
2
at the desired
regulated voltage level will cause a regulation error. As
shown in the Electrical Characteristics table the error
amplifier input at pin FB has an input bias current (I
IB
)
specification that reduces the current into R
2
. (I
IB
is
+
_
+
_
OC
FB
V
CC
C
E
B
V
SS
I
OC
I
Q
R
2
R
1
R
E
I
1
I
H
V
REG
R
3
I
3
R
0
V
REF
+V
LINE
Rectifier
Dimmer Switch
AC Supply
-
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always into pin FB). This error causes the regulated
output voltage to increase which increases the current
through R
1
by an amount equal to I
IB
, thereby
restoring the current through R
2
to its original value.
Reducing the V
REG
error created by the input bias
current to less than 1% is accomplished by setting the
value of R
1
using the following formula:
Where:
2.2 Compensation
The dominate pole of the error amplifier is around
13kHz. In a typical system with a low-bandwidth
requirement, it doesn't need any external
compensation. Frequency response of the system can
be optimized for the specific application by placing a
compensation network between the OC and FB pins
of the IX9915. For designs with more critical
bandwidth requirements, measurement of the loop
response must be made and compensation adjusted
as necessary.
2.3 Design Example
A design example for the bleeder circuitry in LED lamp
exhibits the detailed steps. In this example, it will target
the predetermined voltage V
LINE-TH
=25V and
maximum bleeding current I
H-MAX
=25mA.
In order to flow the maximum bleeding current I
H-MAX
through the Darlington transistor:
If taking R
E
=100:
In fact, the components in the dashed rectangle
function as a comparator, its gain:
If taking R
0
=40k, the gain of the comparator is
around 82dB. That is to say, once the error amplifier
starts to regulate, the Darlington transistor will be shut
off by this comparator. So, I
OC
can be ignored for
affecting the predetermined voltage:
Almost full power supply voltage will cross over R
3
,
taking R
3
=100k to minimize its power consumption:
Substituting:
I
Q
=75A,
I
1
=V
REF
/ R
2
,
V
LINE-TH
=25V
into formula (2):
R
1
V
REG
50A
-------------
50A 100 I
IB MAX
=
V
REG
I
HMAX
R
E
V
BE
+=
(1)
V
REG
I
HMAX
R
E
V
BE
+=
25mA 100 1.5V+=
4V=
A
R
0
R
2
g
m
R
1
R
2
+
------------------------------
=
R
2
R
1
R
2
+
------------------
V
REF
V
REG
-------------
1.299V
4V
-----------------
0.325== =
g
m
1S (typical)=
V
LINE-TH
V
REG
I
1
I
Q
+R
3
+
(2)
P
V
rms

2
100k
------------------ -
=
R
2
9.6k
R
1
R
2
V
REG
V
REF
-------------
1


=
R
1
20k
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3. Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
3.3 Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature
and duration necessary to remove the moisture trapped within the package is the responsibility of the user
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
IX9915N MSL 1
Device
Classification Temperature (T
C
) Dwell Time (t
p
)
Max Reflow Cycles
IX9915N 260°C 30 seconds 3

IX9915NTR

Mfr. #:
Manufacturer:
Description:
LOW VOLTAGE ERROR AMPLIFIER WITH
Lifecycle:
New from this manufacturer.
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