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NB3L853141DTR2G

P1-P3P4-P6P7-P9P10-P10
NB3L853141
www.onsemi.com
7
Figure 3. Differential Input Driven Single−Ended
Figure 4. V
th
Diagram Figure 5. Differential Inputs Driven Differentially
Figure 6. Differential Inputs Driven Differentially
Figure 7. VCMR Diagram
Figure 8. AC Reference Measurement
V
IHD
V
ILD
V
ID
= |V
IHD(IN)
− V
ILD(IN)
|
IN
IN
IN
V
th
IN
IN
IN
IN
IN
Q
Q
t
PLH
t
PHL
V
INPP
= V
IH
(IN) − V
IL
(IN)
V
CC
V
EE
V
thmin
V
thmax
V
th
IN
V
IHmax
V
ILmax
V
IH
V
th
V
IL
V
IHmin
V
ILmin
V
CC
V
EE
V
CMRmin
V
CMRmax
V
CMR
IN
IN
V
IHDmax
V
ILDmax
V
ID
= V
IHD
− V
ILD
V
IHDtyp
V
ILDtyp
V
IHDmin
V
ILDmin
V
th
V
IH
V
IL
Figure 9. SEL to Qx Timing Diagram
tpd tpd
V
CC
/ 2 V
CC
/ 2
SEL
Qx
Qx
NB3L853141
www.onsemi.com
8
Figure 10. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
− 2.0 V
ORDERING INFORMATION
Device Package Shipping
†
NB3L853141DTG TSSOP−20
(Pb−Free)
75 Units / Rail
NB3L853141DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NB3L853141
www.onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
_ ___
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P10

NB3L853141DTR2G

Mfr. #:
Buy NB3L853141DTR2G
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1-TO-5 Diff-TO 2.5V/3.3V LVPECL
Lifecycle:
New from this manufacturer.
Delivery:
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