MF3ICD(H)Q1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330 4 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
4. Quick reference data
[1] Stresses above one or more of the values may cause permanent damage to the device.
[2] Exposure to limiting values for extended periods may affect device reliability.
[3] Measured with LCR meter.
[4] T
amb
= 22 C; f
i
= 13.56 MHz; 2.8 V RMS
5. Ordering information
[1] This package is also known as MOA8.
Table 1. Quick reference data
[1][2]
Symbol Parameter Conditions Min Typ Max Unit
f
i
input frequency - 13.56 - MHz
C
i
input capacitance MF3ICDQ1
[3][4]
14.96 17.0 19.04 pF
MF3ICDHQ1
[3][4]
64.00 69.0 74.00 pF
EEPROM characteristics
t
ret
retention time T
amb
= 22 C10--year
N
endu(W)
write endurance T
amb
= 22 C 200000 500000 - cycle
t
cy(W)
write cycle time T
amb
= 22 C-2.9-ms
Table 2. Ordering information
Type number Package
Name Description Version
MF3ICDQ101DUD/06 FFC 8 inch wafer (sawn; 120 m thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see Ref. 4
, 256B EEPROM, 17 pF
-
MF3ICDHQ101DUD/06 FFC 8 inch wafer (sawn; 120 m thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see Ref. 4
, 256B EEPROM, 70 pF
-
MF3ICDQ101DUF/06 FFC 8 inch wafer (sawn; 75 m thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see Ref. 4
, 256B EEPROM, 17 pF
-
MF3ICDHQ101DUF/06 FFC 8 inch wafer (sawn; 75 m thickness, on film
frame carrier; electronic fail die marking
according to SECSII format); see Ref. 4
, 256B EEPROM, 70 pF
-
MF3MODQ101DA8/06 PLLMC
[1]
plastic leadless module carrier package; 35 mm
wide tape; see Ref. 5, 256B EEPROM, 17 pF
SOT500-4
MF3MODHQ101DA8/06 PLLMC
[1]
plastic leadless module carrier package; 35 mm
wide tape; see Ref. 5
, 256B EEPROM, 70 pF
SOT500-4
MF3ICD(H)Q1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330 5 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
6. Block diagram
7. Limiting values
[1] Stresses above one or more of the limiting values may cause permanent damage to the device.
[2] Exposure to limiting values for extended periods may affect device reliability.
[3] MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 k.
Fig 1. Block diagram of MF3ICD(H)Q1
001aah878
RF
INTERFACE
UART
ISO/IEC
14443A
CRYPTO
CO-PROCESSOR
CPU CRC
EEPROMRAMROM
TRUE RANDOM
NUMBER
GENERATOR
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
Table 3. Limiting values
[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
I
I
input current - 30 mA
P
tot
/pack total power dissipation per
package
-200mW
T
stg
storage temperature 55 125 C
T
amb
ambient temperature 25 70 C
V
ESD
electrostatic discharge voltage
[3]
2-kV
I
lu
latch-up current 100 - mA
MF3ICD(H)Q1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 5 November 2015
351330 6 of 18
NXP Semiconductors
MF3ICD(H)Q1
MIFARE DESFire EV1 256B contactless smartcard IC
8. Functional description
8.1 Contactless energy and data transfer
In the MIFARE system, the MIFARE DESFire EV1 is connected to a coil consisting of a
few turns embedded in a standard ISO/IEC smart card (see Ref. 7
). A battery is not
needed. When the card is positioned in the proximity of the PCD antenna, the high-speed
RF communication interface allows data to be transmitted up to 848 kbit/s.
8.2 Anti-collision
An intelligent anti-collision mechanism allows more than one MIFARE DESFire EV1 in the
field to be handled simultaneously. The anti-collision algorithm selects each MIFARE
DESFire EV1 individually and ensures that the execution of a transaction with a selected
MIFARE DESFire EV1 is performed correctly without data corruption resulting from other
MIFARE DESFire EV1s in the field.
8.3 UID/serial number
The unique 7 byte (UID) is programmed into a locked part of the NV memory which is
reserved for the manufacturer. Due to security and system requirements these bytes are
write-protected after being programmed by the IC manufacturer at production time.
According to ISO/IEC 14443-3 (see Ref. 11
) during the first anti-collision loop the cascade
tag returns a value of 88h and also the first 3 bytes of the UID, UID0 to UID2 and BCC.
The second anti-collision loop returns bytes UID3 to UID6 and BCC.
UID0 holds the manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and
ISO/IEC 7816-6 AMD 1.
MIFARE DESFire EV1 also allows Random ID to be used. In this case MIFARE DESFire
EV1 only uses a single anti-collision loop. The 3 byte random number is generated after
RF reset of the MIFARE DESFire EV1.
8.4 Memory organization
MF3ICD(H)Q1 has 480 bytes of physical NV memory. The NV memory is organized using
a flexible file system. This file system allows a limited number of different applications on
one MIFARE DESFire EV1. Each application can have multiple files. Every application is
represented by its 3 bytes Application IDentifier (AID).
Five different file types are supported; see Section 8.5
.
A guideline to assign DESFire AIDs can be found in the application note MIFARE
Application Directory (MAD); see Ref. 8
.
Each file can be created either at MIFARE DESFire EV1 initialization (card
production/card printing), at MIFARE DESFire EV1 personalization (vending machine) or
in the field.
If a file or application becomes obsolete in operation, it can be permanently invalidated.
Commands which have impact on the file structure itself (e.g. creation or deletion of
applications, change of keys) activate an automatic rollback mechanism, which protects
the file structure from being corrupted.

MF3MODHQ101DA8/06J

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders MF3MODHQ101DA8/PLLMC//06/REEL 13 Q1 NDP
Lifecycle:
New from this manufacturer.
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