ESDALC6V1-5T6 Package information
Doc ID 16741 Rev 2 5/11
3 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Table 3. Micro DFN
1.0 x 1.0-6L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.31 - 0.40 0.012 - 0.016
A1 0.00 0.02 0.05 0.00 0.0008 0.002
b 0.10 0.15 0.20 0.004 0.006 0.008
D 0.95 1.00 1.05 0.037 0.039 0.041
E 0.95 1.00 1.05 0.037 0.039 0.041
L1 0.22 0.32 0.42 0.009 0.012 0.016
e - 0.35 - - 0.014 -
Figure 14. Footprint dimensions (in mm) Figure 15. Marking
D
e
b
Index area
PIN#1 ID
SEATING
TOP VIEW
BOTTOM VIEW
E
0.06
0.56
(D/2xE/2)
SIDE VIEW
A1
PLANE
L=0.36
±0.10
Index area
(D/2xE/2)
L1
A
1.280
0.520
0.560
0.175
0.900
0.240
0.520
0.375
0.200
0.150
0.175
Pin 1
K
