375024B00032G Datasheet 375024B00032G | P1-P2

DATASHEET

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BoardLevelCooling–3750

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USA:1.855.322.2843 BoardLevelCooling

EUROPE:39.051.764002  www.aavid.com

ASIA:86.21.6115.2000x8122 

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MECHANICAL&PERFORMANCE

Drawingdimensionsareshowninmm,(in)

BOARDLEVELCOOLING‐3750

3750isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA

andFPGAdevices.RepresentativeImageOnly.

ORDERINGINFORMATION

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PartNumber DeviceType

375024B00032G BGA,FPGA

375024B60024G BGA,FPGA

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PartNumber:375024B00032G

Property Details

HeatSinkWidth(mm) 40.00

HeatSinkLength(mm) 40.00

HeatSinkHeight(mm) 18.00

HeatSinkMountingDirection Horizontal,Vertical

HEATSINKDETAILS

Property Details

Material Aluminum

Finish BlackAnodize

DeviceAttachmentOptions:

375024B00032G

Tape

DeviceAttachmentOptions:

375024B60024G

SolderAnchorClip

ThermalInterfaceMaterial:

375024B00032G

T411ChomericsTapeforAllSurfaces

ThermalInterfaceMaterial:

375024B60024G

T766ChomericsPhaseChangeforAll

Surfaces

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DATASHEET

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BoardLevelCooling–3750



USA:1.855.322.2843 BoardLevelCooling

EUROPE:39.051.764002  www.aavid.com

ASIA:86.21.6115.2000x8122 

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PartNumber:375024B60024G

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MountingDetails:

P1-P2

375024B00032G

Mfr. #:

Buy 375024B00032G

Manufacturer:

Aavid, Thermal Division of Boyd Corporation

Description:

Heat Sinks Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 40x40x18mm, IC Pkg Size = 40 x 40, Tape #32

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

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375024B00032G