9
Signal Detect
The Signal Detect circuit provides a de-asserted output
signal when the optical link is broken (or when the
remote transmitter is OFF). The Signal Detect threshold
is set to transition from a high to low state between the
minimum receiver input optical power and -45 dBm
avg. input optical power indicating a denite optical
fault (e.g. unplugged connector for the receiver or
transmitter, broken ber, or failed far-end transmitter or
data source). The Signal Detect does not detect receiver
data error or error-rate. Data errors can be determined
by signal processing oered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electron-
ic equipment. Success in controlling generated Elec-
tromagnetic Interference (EMI) enables the designer to
pass a governmental agency’s EMI regulatory standard
and more importantly, it reduces the possibility of in-
terference to neighboring equipment. Avago Technolo-
gies has designed the AFCT-5961TLZ/TGZ/ATLZ/ATGZ/
NLZ/NGZ to provide excellent EMI performance. The
EMI performance of a chassis is dependent on physical
design and features which help improve EMI suppres-
sion. Avago Technologies encourages using standard RF
suppression practices and avoiding poorly EMI-sealed
enclosures.
Avago Technologies’ OC-3 LC transceivers (AFCT-
5961TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ) have nose shields
which provide a convenient chassis connection to
the nose of the transceiver. This nose shield improves
system EMI performance by eectively closing o the
LC aperture. The recommended transceiver position,
PCB layout and panel opening for these devices are the
same, making them mechanically drop-in compatible.
Figure 8 shows the recommended positioning of the
transceivers with respect to the PCB and faceplate.
Recommended Solder and Wash Process
The AFCT-5961TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ are com-
patible with industry-standard wave solder processes.
7.59
(0.299)
3
(0.118)
3
(0.118)
6
(0.236)
4.57
(0.18)
4 x 1.78
(0.07)
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
3.08
(0.121)
2 x Ø 2.29
(0.09)
9.59
(0.378)
2
(0.079)
13.34
(0.525)
7.11
(0.28)
4 x Ø 1.4 ±0.1
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
(0.055 ±0.004)
10.16
(0.4)
3.56
(0.14)
2 x Ø 2.29 MAX.
(0.09)
17.8
(0.700)
2
(0.079)
*4
*5
DIMENSIONS IN MILLIMETERS (INCHES)
Figure 7. Recommended Board Layout Hole Pattern
NOTES:
1. THIS FIGURE DESCRIBES MSA RECOM-
MENDED CIRCUIT BOARD LAYOUT FOR
THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT
AREAS RESERVED FOR HOUSING
STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT
AREAS.
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16
PCB HOLES (10 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS). PACKAGE GROUNDING TABS
SHOULD BE CONNECTED TO SIGNAL
GROUND.
*4. THE MOUNTING STUDS SHOULD BE
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER
SFF TRANSCEIVERS.
*5. HOLES FOR OPTIONAL HOUSING LEADS
MUST BE TIED TO SIGNAL GROUND.