MP18021―100V HIGH FREQUENCY HALF-BRIDGE GATE DRIVER
MP18021 Rev. 1.11 www.MonolithicPower.com 2
10/20/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2015 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature (T
A
)
MP18021HN
SOIC8EP
MP18021HN
-40C to + 125C
MP18021HQ
QFN8 (3x 3mm)
ABN
-40C to + 125C
* For Tape & Reel, add suffix –Z (e.g. MP18021HN–Z);
For RoHS compliant packaging, add suffix –LF; (e.g. MP18021HN–LF–Z)
For Tape & Reel, add suffix –Z (e.g. MP18021HQ–Z);
For RoHS compliant packaging, add suffix –LF; (e.g. MP18021HQ–LF–Z)
PACKAGE REFERENCE
VDD
BST
DRVH
SW
DRVL
VSS
INL
INH
1
2
3
4
8
7
6
5
TOP VIEW
TOP VIEW
VDD
BST
DRVH
SW
1
2
3
4
DRVL
VSS
INL
INH
8
7
6
5
EXPOSED PAD
ON BACKSIDE
SOIC8EP QFN8
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage (V
DD
).....................-0.3V to +18V
SW Voltage (V
SW
) .........................-5.0V to 100V
BST Voltage (V
BST
) .......................-0.3V to 100V
BST to SW ....................................-0.3V to +18V
DRVH to SW.................................-0.3V to +18V
All Other Pins...................... -0.3V to (V
DD
+0.3V)
Continuous Power Dissipation (T
A
=+25°C)
(2)
SOIC8 (Exposed Pad) ............................... 2.6W
QFN8 (3x3) ................................................ 2.5W
Junction Temperature...............................150C
Lead Temperature ....................................260C
Storage Temperature............... -65°C to +150C
Recommended Operating Conditions
(3)
Supply Voltage V
DD
.....................+9.0V to 16.0V
SW Voltage (V
SW
) ..................-1.0V to 100V-V
DD
SW slew rate......................................<50V/nsec
Operating Junct. Temp (T
J
)...... -40C to +140C
Thermal Resistance
(4)
θ
JA
θ
JC
SOIC8 (Exposed Pad) ............ 48 ...... 10... C/W
QFN8 (3x3)............................. 50 ...... 12... C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/ θ
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
