MP8005 – IEEE 802.3af PoE POWERED DEVICE CONTROLLER
MP8005 Rev. 1.0 www.MonolithicPower.com 2
9/26/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Temperature
MP8005DF TSSOP-20-EP MP8005DF
–40°C to +85°C
For Tape & Reel, add suffix –Z (e.g. MP8005DF–Z).
For Lead Free, add suffix –LF (e.g. MP8005DF–LF–Z)
PACKAGE REFERENCE
AGND
ISENSE
RDELAY
VFB
NC
VDD
PG
RTN
RTN
COMP
VCC
MAINGATE
SYNCGATE
CSS
ENABLE
ILIM
CLASS
DET
VSS
NC
ABSOLUTE MAXIMUM RATINGS
(1)
V
DD
, RTN....................................–0.3V to +100V
PG, DET ......................................–0.3V to +57V
V
CC
, CLASS .................................–0.3V to +10V
I
LIM
, CSS, ENABLE. .......................–0.3V to +5V
I
SENSE
. ...........................................–0.3V to +28V
COMP. ...........................................–0.3V to +3V
FB . .............................................–0.3V to +1.3V
Continuous Power Dissipation (T
A
= +25°C)
(2)
. ............................................................ 1.2W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
DD
.............................0V to 57V
Output Current I
OUT
.............................. 0 to 0.4A
Junction Temperature T
J
......... –40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
TSSOP-20-EP........................105 ..... 50 ... °C/W
Notes:
1) Exceeding “Absolute Maximum Ratings” may cause
permanent damage to the device. Functional operation at or
above these conditions is not implied
Exposure to these conditions for extended periods may
affect device reliability.
2) The maximum allowable power dissipation is a function of
the maximum junction temperature. T
J
(MAX) the junction-to-
ambient thermal resistance. θ
JA
and the ambient
temperature, T
A
the maximum allowable power dissipation at
any ambient temperature is calculated using:
P
D
(MAX)=(T
J
(MAX)-T
A
)/ θ
JA
. Exceeding the maximum
allowable power dissipation will cause excessive die
temperature, and the regulator will go into thermal shutdown.
Internal thermal shutdown circuitry protects the device from
permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
