IXTR62N15P

© 2006 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25° C to 150° C 150 V
V
DGR
T
J
= 25° C to 150° C; R
GS
= 1 M 150 V
V
GS
Continuous ± 20 V
V
GSM
Transient ± 30 V
I
D25
T
C
= 25° C36A
I
DM
T
C
= 25° C, pulse width limited by T
JM
150 A
I
AR
T
C
= 25° C50A
E
AR
T
C
= 25° C30mJ
E
AS
T
C
= 25° C 1.0 J
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
, 10 V/ns
T
J
150° C, R
G
= 10
P
D
T
C
= 25° C 150 W
T
J
-55 ... +175 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
F
C
Mounting force ISOPLUS220 11..65 / 2.5..15 N/lb
ISOPLUS247 20..120 / 4.5..25 N/lb
Weight ISOPLUS220 3 g
ISOPLUS247 5 g
G = Gate D = Drain
S = Source TAB = Drain
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0 V, I
D
= 250 µA 150 V
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 3.0 5.0 V
I
GSS
V
GS
= ± 20 V
DC
, V
DS
= 0 ± 100 nA
I
DSS
V
DS
= V
DSS
10 µA
V
GS
= 0 V T
J
= 125° C 200 µA
R
DS(on)
V
GS
= 10 V, I
D
= 31 A, Note 1 45 m
PolarHT
TM
Power
MOSFET
(Electrically Isolated Tab)
N-Channel Enhancement Mode
Avalanche Rated
IXTC 62N15P
IXTR 62N15P
V
DSS
= 150 V
I
D25
=36 A
R
DS(on)
45 m
DS99622E(05/06)
G
D
S
ISOPLUS220 (IXTC)
E153432
Isolated back surface
Features
l
International standard isolated
packages
l
UL recognized packages
l
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
l
Unclamped Inductive Switching (UIS)
rated
l
Low package inductance
- easy to drive and to protect
l
Fast intrinsic diode
Advantages
l
Easy to mount
l
Space savings
l
High power density
G
D
S
ISOPLUS247 (IXTR)
E153432
Isolated back surface
Preliminary Technical Information
IXYS reserves the right to change limits, test conditions, and dimensions.
IXTC 62N15P
IXTR 62N15P
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified)
Min. Typ. Max.
g
fs
V
DS
= 20 V; I
D
= 31 A, Note 1 14 24 S
C
iss
2250 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 660 pF
C
rss
185 pF
t
d(on)
27 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 62 A 38 ns
t
d(off)
R
G
= 10 (External) 76 ns
t
f
35 ns
Q
g(on)
70 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 31 A 20 nC
Q
gd
38 nC
R
thJC
1.0 °C/W
R
thCS
0.15 ° C/W
Source-Drain Diode Characteristic Values
T
J
= 25° C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
I
S
V
GS
= 0 V 62 A
I
SM
Repetitive 150 A
V
SD
I
F
= I
S
, V
GS
= 0 V, Note 1 1.5 V
t
rr
I
F
= 25 A, -di/dt = 100 A/µs 150 ns
Q
RM
V
R
= 100 V, V
GS
= 0 V 2.0 µC
Note 1: Pulse test, t 300 µs, duty cycle d 2 %;
2: Test current I I
T
= 62 A.
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734B2
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6771478 B2
ISOPLUS220
TM
(IXTC) Outline
Ref: IXYS CO 0177 R0
Note:
Bottom heatsink (Pin 4) is
electrically isolated from Pin
1,2, or 3.
ISOPLUS247 (IXTR) Outline
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications
offered are derived from data gathered during objective characterizations of preliminary
engineering lots; but also may yet contain some information supplied during a pre-
production design evaluation. IXYS reserves the right to change limits, test conditions,
and dimensions without notice.

IXTR62N15P

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET 62 Amps 150V 0.045 Rds
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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