Characteristics SM15TY
4/12 Doc ID 17865 Rev 3
Figure 3. Peak pulse power dissipation
versus initial junction temperature
(typical values)
Figure 4. Peak pulse power versus
exponential pulse duration
(T
j
initial = 25 °C)
0
500
1000
1500
2000
0 25 50 75 100 125 150
175
P (W)
PP
T (°C)
j
10/1000 µs
0.1
1.0
10.0
100.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
P (kW)
PP
t
p
(ms)
Figure 5. Clamping voltage versus peak
pulse current (exponential
waveform, maximum values)
Figure 6. Junction capacitance versus
reverse applied voltage for
unidirectional types (typical values)
I (A)
PP
0.1
1.0
10.0
100.0
1000.0
1 10 100 1000
10/1000 µs
8/20 µs
V (V)
CL
SM15T6V8AY/CAY
SM15T30AY/CAY
SM15T82AY/CAY
T = 25 °C
j initial
C(pF)
100
1000
10000
1 10 100 1000
SM15T6V8AY
SM15T30AY
SM15T82AY
V (V)
R
F = 1 MHz
V = 30 mV
T = 25 °C
OSC RMS
j
Figure 7. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
C(pF)
100
1000
10000
1 10 100 1000
SM15T6V8CAY
SM15T30CAY
SM15T82CAY
F = 1 MHz
V = 30 mV
T = 25 °C
OSC RMS
j
V (V)
R
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
Cu
Printed circuit board FR4,
copper thickness = 35 µm
