ADG658/ADG659 Data Sheet
Rev. D | Page 20 of 20
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
09-12-2014-A
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
ADG658YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YCPZ −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG658YCPZ-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG658YRQ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ-REEL7 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADW54003-0 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADW54003-0RL7
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659WYRUZ-REEL7
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YCPZ
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG659YCPZ-REEL7
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG659YRQZ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54003 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
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D03273-0-11/16(D)
