Characteristics BAT46 Series
4/11
Figure 7. Forward voltage drop versus
forward current (typical values,
high-level)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
e
CU
= 35 µm (SOD-323)
1.E-02
1.E-01
1.E+00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
I
FM
A
Tj=125 °C
Tj=25 °C
V
FM
(V)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-323
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
t
P
(s)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Figure 10. Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, e
CU
= 35 µm (SOT-323)
Figure 11. Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
e
CU
= 35 µm (SOD-323)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT-23
Alumine substrate
10 x 8 x 0.5 mm
t
P
(s)
10
100
1000
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
(°C/W)
Single pulse
SOT-323
t
P
(s)
300
350
400
450
500
550
600
0 5 10 15 20 25 30 35 40 45 50
R
th(j-a)
°
W
S
CU
(mm²)
